Skip to content

Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced system-in-package applications.

SiPaste® C312HF boosts process yields that combine best-in-class stencil print transfer efficiency and excellent stencil life with consistent printing, excellent response-to-pause, and superior reflow performance. SiPaste® C312HF post-reflow flux residue can be cleaned with a standard cleaning process using semi-aqueous chemistries or a saponifier, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not required.

SiPaste® C312HF delivers several benefits to users, including:

  • Consistent with low standard deviation solder deposit spread across multiple prints
  • Excellente résistance à l'affaissement
  • Low voiding across all components
  • Optimized powder formulation and flux vehicle
  • Requires minimal stencil cleaning during printing
  • Large fenêtre de profil de refusion
  • Excellent wetting capability on various metallization

Indium Corporation’s SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8, including the SiPaste® C312HF with Type 7 powder. The products help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.

To learn more about Indium Corporation’s semiconductor solder pastes, visit https://www.indium.com/products/solder-paste/semiconductor/.    

À propos d'Indium Corporation

IndiumCorporation® est l'un des principaux raffineurs, fondeurs, fabricants et fournisseurs de matériaux destinés aux marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Sa gamme de produits comprend des soudures et des flux ; des alliages de brasage ; des matériaux d'interface thermique ; des cibles de pulvérisation ; de l'indium, du gallium, du germanium et de l'étain sous forme de métaux et de composés inorganiques ; ainsi quele NanoFoil®. Fondée en 1934, la société dispose d'un service d'assistance technique mondial et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.

Pour plus d'informations sur Indium Corporation, rendez-vous sur indiumstg.wpenginepowered.com ou envoyez un e-mail à [email protected]. Vous pouvez également suivre nos experts, « From One Engineer ToAnother® » (#FOETA), sur www.linkedin.com/company/indium-corporation/.