Fine Powder Pastes
PicoShot® Series Jetting Pastes
Indium Corporation, an innovator in jetting pastes, works closely with Mycronic, one of the leading solder jet printer manufacturers, to offer a simple solution for both small and large-volume solder jetting applications. Utilizing jetting solder paste is increasingly popular for fine-feature assemblies in electronics manufacturing across diverse industries such as automotive and advanced packaging.
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Product Overview
Jetting vs. Dispensing
While jetting and dispensing are similar in enabling precise solder deposition on patterns typically unattainable with a stencil, there are some differences. In jetting, there is no Z-axis movement from the jet head or contact with the substrate, leading to enhanced throughput. This necessitates specific rheological adjustments to optimize solder paste for jetting compared to dispensing, whether through flux chemistry or metal load. Our PicoShot® series has been optimized and approved by Mycronic for use in their jetting equipment.
Powder Size and Deposit Size
PicoShot® can accommodate as large as Type 5 solder alloy powder, with particles ranging from 20 to 25 μm in diameter. While larger particles risk clogging the paste ejector, the jetting process allows for additive deposition, enabling substantial paste application even with small powder sizes.
Mycronic “Qualified” vs. Mycronic “Jettable”
When ordering a PicoShot® product, it’s important to distinguish between a “qualified” and a “jettable” product to ensure compatibility and a smooth ordering process. A “qualified” paste has undergone rigorous scale-up testing by both Mycronic and Indium Corporation, verifying key properties such as shelf life and ejector durability. These pastes also feature a barcode, allowing Mycronic jet printers to instantly load the optimal jetting parameters. A “jettable” paste, on the other hand, hasn’t undergone ejector life testing and lacks a barcode but has passed a proof-of-concept jetting test. These are best suited for low-volume applications or when qualified products may not be available.
PicoShot® Series Jetting Paste Products
| Flux Type | Powder Size | Alloy | Qualified or Jettable | Minimum Dot Size (μm) | Material |
|---|---|---|---|---|---|
| NC | Type 5 | SAC305 | Qualified | 360 | PicoShot® NC-5M |
| WS | Type 5 | Sn63 | Qualified | 350 | PicoShot® WS-5M |
| NC | Type 6 | SAC305 | Qualified | 230 | PicoShot® NC-6M |
| NC | Type 5 | Sn63 | Jettable | 360 | PicoShot® NC-5M |
Product Data Sheets
SnPb PicoShot® NC-5M PDS 100016 R5.pdf
SnPb PicoShot® NC-5M PDS 100016 (A4) R5.pdf
PicoShot® NC-6M PDS 100212 R1.pdf
PicoShot® WS-5M Jetting Solder Paste PDS 99870 R4.pdf
Related Applications
The PicoShot® Series is suitable for a variety of applications.
SiP & Heterogeneous Integration Assembly (HIA)
System-in-package (SiP) and heterogeneous integration solutions
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Related Markets
Indium Corporation’s jetting pastes enable simple assembly in markets that require precise solder dot deposition.
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