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Donut Shaped Solder Preforms for the Pin-in-Paste Process

Folks,

Some years ago I created a software tool, StencilCoachTM to calculate the stencil parameters to provide for an adequate amount of solder paste for the pin-in-paste process. Since solder paste is typically 50% by volume flux, it is often the case that the solder paste cannot supply enough solder to form a proper fillet for the through-hole solder joint. Solder preforms the shape of passives have often been used to supplement the required solder volume.


Figure 1. The input page for donut shaped solder preforms.

Some assemblers might want to use donut shaped solder preforms. So I upgraded StencilCoach™ to be able to perform the calculations for these preforms. Figure 1. shows the input page. Check it out here. Let me know what you think. [email protected].

Cheers,

Dr. Ron