Blogue

Apoio

Electronics Assembly Process Optimization Using AuditCoach™

Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he

Produtos

Specifying Solder Preforms – Flux

Flux… It would be great to live in a world where we didn’t need it. Unfortunately, that same oxygen that keeps us alive slowly erodes the solderability of surface finishes on most

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Fluxless Soldering

When I was learning about solder, I was very surprised when I received a call inquiring about fluxless soldering. Trulyproviding a goodsolder jointwithout using flux; pretty selfexplanatory. Ever

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Die-Attach Soldering Using Indium Alloys

There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing

Apoio

Specifying Solder Preforms – Dimensions

Have you ever ordered something in the wrong size? It’s frustrating. Whether it’s a jacket that’s too tight or a refrigerator that is too big, the worst time to learn about the

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O que é Cicret e qual a sua importância?

Pessoal, vamos ver como está a Patty...... Patty teve de admitir que estava a ficar irritada. Duas das alunas de engenharia estavam sempre a ir ao escritório do seu marido Rob para

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O maior compromisso na impressão de pastas de solda UltraFine ocorre na fase de refluxo

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below

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Outsourcing Manufacturing is not Part of DFM

Folks, Looks like Patty has been busy….. Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point

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Um processo de impressão de pasta de solda 10 Sigma?

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

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SMT Optimization For Success – Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT

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Cálculos de abertura de pino em pasta usando pré-formas de solda com o StencilCoach

Pessoal, como mencionado no último post, é um problema comum com o processo PIP (pin-in-paste) lutar para obter solda adequada

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Optimization for Success: Solder Mask Defined vs. Copper Defined Non-Solder Mask Defined) Pads

Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure

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How to Evaluate a Wave Solder Flux

The title of this blog is a little misleading because it is actually going to focus on aninappropriatemethod that is sometimes used in wave solder flux evaluations. It is always desirable to identify

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Pin-in-Paste Aperture Solder Volume Calculations with StencilCoach(TM)

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, assuring that the correct

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Quadrado com cantos de raio vs. aberturas circulares: Otimização SMT para o sucesso Parte 4:

Na nossa investigação contínua e na tentativa de melhorar a impressão de pasta de solda para depósitos de pasta de caraterísticas finas, também descobrimos que a consistência (baixo desvio padrão) favorecia as aberturas quadradas quando

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Properties and Applications of Low Temperature Solders – don’t miss this presentation!

If you are attending SMTAI this year, you should not miss Dr. Ning-Cheng Lee’s professional development course on Properties and Applications of Low Temperature Solders. The course discusses

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O paradoxo dos falsos positivos

Folks, Let's check in on Patty……. Patty was intensely preparing a lecture on Bayes' Theorem. She always felt that this theorem was the most profound in probability and statistics.

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SMT Optimization for Success Part 3: Flux Chemistry

SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble

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Stencil Printing for SMT Assembly Success Part 2: Print Metrics

(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI)

Apoio

Demonstrating Zero Defects In SMT Production?

Folks, let’s see how Patty is doing at Ivy U….. Patty had to admit that she really liked being a professor at Ivy University. No, that wasn’t strong enough; she was ecstatic. The

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Viscosidade e a natureza imprimível da pasta de solda

Let's talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most part, remains where it was

Na Indium, investigamos, desenvolvemos e fabricamos soluções avançadas de materiais de montagem de eletrónica para os desafios de hoje, de amanhã e do futuro.