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Electronics Assembly Process Optimization Using AuditCoach™
Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he
Specifying Solder Preforms – Flux
Flux… It would be great to live in a world where we didn’t need it. Unfortunately, that same oxygen that keeps us alive slowly erodes the solderability of surface finishes on most
Die-Attach Soldering Using Indium Alloys
There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing
Specifying Solder Preforms – Dimensions
Have you ever ordered something in the wrong size? It’s frustrating. Whether it’s a jacket that’s too tight or a refrigerator that is too big, the worst time to learn about the
在印刷超細焊膏的過程中,最大的取捨在於回流階段
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below
製造外包並非DFM(設計製造)的一部分
Folks, Looks like Patty has been busy….. Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point
10 西格瑪錫膏印刷製程?
SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as
SMT Optimization For Success – Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT
Optimization for Success: Solder Mask Defined vs. Copper Defined Non-Solder Mask Defined) Pads
Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure
How to Evaluate a Wave Solder Flux
The title of this blog is a little misleading because it is actually going to focus on aninappropriatemethod that is sometimes used in wave solder flux evaluations. It is always desirable to identify
使用 StencilCoach(TM) 進行引腳貼片孔徑焊料量計算
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, assuring that the correct
Properties and Applications of Low Temperature Solders – don’t miss this presentation!
If you are attending SMTAI this year, you should not miss Dr. Ning-Cheng Lee’s professional development course on Properties and Applications of Low Temperature Solders. The course discusses
SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble
Stencil Printing for SMT Assembly Success Part 2: Print Metrics
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI)
Demonstrating Zero Defects In SMT Production?
Folks, let’s see how Patty is doing at Ivy U….. Patty had to admit that she really liked being a professor at Ivy University. No, that wasn’t strong enough; she was ecstatic. The
Viscosity And The Printable Nature of Solder Paste
Let's talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most part, remains where it was
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在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。

