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Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he

Flux… It would be great to live in a world where we didn’t need it. Unfortunately, that same oxygen that keeps us alive slowly erodes the solderability of surface finishes on most

When I was learning about solder, I was very surprised when I received a call inquiring about fluxless soldering. Trulyproviding a goodsolder jointwithout using flux; pretty selfexplanatory. Ever

There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing

Have you ever ordered something in the wrong size? It’s frustrating. Whether it’s a jacket that’s too tight or a refrigerator that is too big, the worst time to learn about the

みなさん、パティの様子を見ましょう......。パティは正直、イライラしていた。工学部の女子学生2人が、いつも夫のロブのオフィスに出入りしているのだ。

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below

Folks, Looks like Patty has been busy….. Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT

皆さん、前回の投稿で述べたように、PIP（ピン・イン・ペースト）工程でよくある問題ですが、適切なはんだを得るのに苦労します。

Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure

The title of this blog is a little misleading because it is actually going to focus on aninappropriatemethod that is sometimes used in wave solder flux evaluations. It is always desirable to identify

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, assuring that the correct

微細なペーストを印刷するためのソルダーペースト印刷を改善するための継続的な調査と探求において、我々はまた、一貫性（低標準偏差）は、以下の場合に正方形の開口部が有利であることを発見しました。

If you are attending SMTAI this year, you should not miss Dr. Ning-Cheng Lee’s professional development course on Properties and Applications of Low Temperature Solders. The course discusses

Folks, Let's check in on Patty……. Patty was intensely preparing a lecture on Bayes' Theorem. She always felt that this theorem was the most profound in probability and statistics.

SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble

(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI)

Folks, let’s see how Patty is doing at Ivy U….. Patty had to admit that she really liked being a professor at Ivy University. No, that wasn’t strong enough; she was ecstatic. The

Let's talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most part, remains where it was