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Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You

Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your

There are many types of wave solder machines, each with their own quirks, characteristics, and personalities. The good news is, each has the same core process elements, making it easier (maybe not

Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he

Flux… It would be great to live in a world where we didn’t need it. Unfortunately, that same oxygen that keeps us alive slowly erodes the solderability of surface finishes on most

납땜에 대해 배우던 중, 플럭스 없는 납땜에 대해 문의하는 전화를 받았을 때 정말 놀랐습니다. 플럭스를 사용하지 않고도 양질의 납땜 접합부를 만드는 것, 말 그대로 그 뜻이 자명하죠. 언제나

There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing

Have you ever ordered something in the wrong size? It’s frustrating. Whether it’s a jacket that’s too tight or a refrigerator that is too big, the worst time to learn about the

여러분, 패티를 확인해 봅시다...... 패티는 짜증이 난다는 사실을 인정해야 했습니다. 두 명의 여자 공대생이 항상 남편인 Rob의 사무실로 가곤 했기 때문입니다.

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below

Folks, Looks like Patty has been busy….. Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as we look at the effect of solder

여러분, 지난 게시물에서 언급했듯이 PIP(핀 인 페이스트) 공정에서 적절한 납땜을 얻는 데 어려움을 겪는 것은 일반적인 문제입니다.

제5부: 솔더 마스크 정의 패드와 구리 정의(솔더 마스크 미정의) 패드 비교 그림

The title of this blog is a little misleading because it is actually going to focus on aninappropriatemethod that is sometimes used in wave solder flux evaluations. It is always desirable to identify

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, assuring that the correct

미세 피처 페이스트 증착을 위한 솔더 페이스트 프린팅을 개선하기 위한 지속적인 조사 및 탐구 과정에서 다음과 같은 경우 일관성(낮은 표준 편차)이 사각형 조리개를 선호한다는 사실도 발견했습니다.

If you are attending SMTAI this year, you should not miss Dr. Ning-Cheng Lee’s professional development course on Properties and Applications of Low Temperature Solders. The course discusses

Folks, Let's check in on Patty……. Patty was intensely preparing a lecture on Bayes' Theorem. She always felt that this theorem was the most profound in probability and statistics.

In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder