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Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he

Flux… It would be great to live in a world where we didn’t need it. Unfortunately, that same oxygen that keeps us alive slowly erodes the solderability of surface finishes on most

When I was learning about solder, I was very surprised when I received a call inquiring about fluxless soldering. Trulyproviding a goodsolder jointwithout using flux; pretty selfexplanatory. Ever

There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing

Have you ever ordered something in the wrong size? It’s frustrating. Whether it’s a jacket that’s too tight or a refrigerator that is too big, the worst time to learn about the

여러분, 패티를 확인해 봅시다...... 패티는 짜증이 난다는 사실을 인정해야 했습니다. 두 명의 여자 공대생이 항상 남편인 Rob의 사무실로 가곤 했기 때문입니다.

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below

Folks, Looks like Patty has been busy….. Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

성공을 위한 SMT 최적화 제6편: 솔더 페이스트 입자 크기와 스텐실 인쇄에 미치는 영향 초미세 솔더 페이스트 도포 SMT의 스텐실 인쇄 측면을 다룬 시리즈의 마지막 글입니다.

여러분, 지난 게시물에서 언급했듯이 PIP(핀 인 페이스트) 공정에서 적절한 납땜을 얻는 데 어려움을 겪는 것은 일반적인 문제입니다.

제5부: 솔더 마스크 정의 패드와 구리 정의(솔더 마스크 미정의) 패드 비교 그림

The title of this blog is a little misleading because it is actually going to focus on aninappropriatemethod that is sometimes used in wave solder flux evaluations. It is always desirable to identify

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, assuring that the correct

미세 피처 페이스트 증착을 위한 솔더 페이스트 프린팅을 개선하기 위한 지속적인 조사 및 탐구 과정에서 다음과 같은 경우 일관성(낮은 표준 편차)이 사각형 조리개를 선호한다는 사실도 발견했습니다.

If you are attending SMTAI this year, you should not miss Dr. Ning-Cheng Lee’s professional development course on Properties and Applications of Low Temperature Solders. The course discusses

Folks, Let's check in on Patty……. Patty was intensely preparing a lecture on Bayes' Theorem. She always felt that this theorem was the most profound in probability and statistics.

SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble

(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI)

Folks, let’s see how Patty is doing at Ivy U….. Patty had to admit that she really liked being a professor at Ivy University. No, that wasn’t strong enough; she was ecstatic. The

Let's talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most part, remains where it was