Biblioteca
Blogue
Tópico
Tipo
Ano
Autor
Tipo de produto
Qual é a melhor forma de soldar em Nitinol?
Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other
Em busca de falhas de cinzel de estanho na soldadura sem chumbo
Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin
ITO (Indium-Tin Oxide) Sputtering Target Reclaim/Recycling
ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the
Migração Electromagnética (EM) e Migração Eletroquímica (ECM)
I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of
Compatibilidade de revestimentos conformacionais com resíduos de fluxo de pasta de solda sem limpeza: Quando limpar?
Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and
Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have
It’s Wrong to Average or Add Cp and Cpk
Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick” of solder paste on the PWB pads. The product had
The Law of Exponential Profits
Folks, Let’s assume you are trying to improve the productivity of your SMT assembly lines. You work at a facility that manufactures high volume products with a high mix. The first aspect of your
The Conclusion of “Bob and Fred Breaks”
Folks, The conclusion of the Bob and Fred break saga…… Phil stared, “The uptime on AXI’s four SMT production lines is…….” Fred and Bob were waiting for the good news of
A saga de Fred e Bob Breaks continua
(continued from previous post) “Fred break, Bob break?” Phil asked. Folks, The "Fred and Bob Breaks"saga continues, “Fred is the tech responsible for the stencil printer
Bob Breaks and Fred Breaks
Folks, Dr. Phil James, a former student of “The Professor”, gets a phone call, let’s listen in…… Phil James was staring out the window of his office in Exeter, NH.Fall
Transitioning from Water-Soluble Solder Paste Flux to No-Clean Solder Paste Flux
I just visited a customer that was converting from water soluble solder paste to no-clean. Not exactly a slam dunk transition as this customer found out. During my visit, solder balls and solder
A metalurgia como alquimia moderna: o bismuto
Embora a maior parte dos cientistas de hoje considere que a alquimia foi amplamente desacreditada, e eu fui ensinado a concordar, a ideia é caprichosa e
Bismuto: O meu novo amigo
Ultimamente tenho andado a investigar uma série de coisas, sendo um dos meus temas favoritos as ligas de soldadura. Durante muito tempo, a maior parte da solda (quase toda) era composta por estanho-chumbo eutéctico
Understanding Thermal Resistance Calculations
I have previously discussed various reasons why thermal considerations in a device cannot be an afterthought.There are various methods for handling the thermal needs of a device before it becomes a
Gallium Solder Alloys: Questions & Answers
I’ve received numerous questions about using gallium liquid metal alloys, so thought I’d present some of my answers for all. The customerquestions are in black, and my responses in red.
Colisão de bolachas e substratos com pasta de solda (II)
... e voltamos à questão de "de que tamanho de partícula de pó de solda preciso para atingir uma determinada altura ou altura de saliência
Colisão de bolacha e substrato com pasta de solda (I)
O tema desta semana é a colisão de bolachas e substratos com pasta de solda, e a questão do pó
SMT Soldering Reflow Profiling and Ramp Rates
Solder paste is made to be reflowed in the SMT process. Exactly HOW that is done is critical to your success. Included in the Product Data Sheet, among other things, are parameters which guide the
Soldering 101 CTE Mismatch
The Northeast USA (as well as other parts of the country) have been experiencing quite a warm summer. And, if walking out into the humidity wasn't clue enough, I would just have to test the fit
Patty e Rob têm sucesso com duas linhas de alta disponibilidade.
Folks, The adventures of Patty and Rob continue……. Rob bolted upright in bed. He had that terrible feeling that he had overslept for an important appointment. His eyes quickly found the
Não tem a certeza do que precisa?
Deixe-nos ajudar.
Na Indium, investigamos, desenvolvemos e fabricamos soluções avançadas de materiais de montagem de eletrónica para os desafios de hoje, de amanhã e do futuro.