Biblioteca
Blog
Tema
Tipo
Año
Autor
Tipo de producto
Grabado del indio para eliminar óxidos
En relación con la soldadura o la humectación (recubrimiento) con indio, a menudo se nos pide que comentemos la formación de óxido de indio y cómo eliminarlo. También nos preguntan cuánto tardará el óxido
Soldering to Stainless Steel
We are often asked if it is possible to solder to stainless steel and, if so, what is the best procedure.As you may already know, stainless steel is not easy to solder but it can be done with a
Soldering to Aluminum
We are frequently asked if it is possible to solder to aluminum.The answer is yes, if the following guidelines are followed: FLUXES: Because it is difficult to solder to aluminum, Indium Corporation
Patty Cost Analyzes an MRI scan
Folks, Let’s see how Patty is doing with the latest crisis…… Upon hearing Claire Perkins inform her that Rob was in the hospital, Patty froze and her face looked ashen.She quickly
Pasar de las soldaduras con alto contenido en plomo a las eutécticas de AuSn
Two categories of solder are available to choose from when the in-service environment for a device reaches above 125°C either in continuous operation or thermal cycling accelerated life
Patty Pitches NMAC/I/O
Folks, Patty arrived at work an hour early to prepare for her meeting with ACME CEO Mike Madigan.Nineteen days ago, he had asked her to develop an electronics assembly metric that would correlate
Intermetálicos de indio-cobre en soldadura
Indium and indium-containing alloys see wide use in a multitude of soldering applications. Indium has many attractive properties such as remaining ductile at cryogenic temperatures, compatibility
Reducción de huecos en uniones soldadas
It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is
Soldadura en frío del metal de indio
El indio metálico tiene la capacidad única de soldarse en frío a temperatura ambiente. Aunque técnicamente no se trata de soldadura, esta propiedad lo hace especialmente útil para unir metales a baja temperatura.
Tombstoning: The Death of a PCBA
Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as occurring when one end of a passive device, such as
Patty busca la métrica definitiva de la productividad en el ensamblaje de componentes electrónicos
Folks, Let's look in on Patty…… Patty was just finishing a report on work that she and Pete had performed with a team of her ACME colleagues on reducing the Head-in-Pillow (HIP)
Recomendaciones de soldadura manual para el montaje de módulos solares
He aquí una lista de trucos que le ayudarán a superar los problemas que pueden surgir al soldar a mano células solares de silicio (y otras aplicaciones como
Estadísticas: ¿Cómo de inusual es el 0-11 de Nueva Orleans?
Folks, In addition to electronics assembly productivity, solder paste and solder preform applications, and other electronics assembly concerns, many of you know that I teach statistics and have been
Caducidad de la pasta de soldadura
Solder paste is comprised of powdered solder alloy suspended in a flux vehicle. There is a group of flux ingredients that is generically identified as
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time… As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I were discussing some puzzling results for low
Intermetálicos en soldadura
Intermetallics are a necessary evil in the metal-to-metal bonding world, which definitely includes soldering. There are two basic ways that metal will "chemically"bond to another metal: 1)
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest
Reciclaje de escoria de soldadura
Cualquiera que haya utilizado la soldadura por ola para ensamblar placas de circuito impreso conoce esa gruesa capa de metal que se acumula en la superficie lisa de la soldadura fundida.
Resolver el problema del vaciado de QFN con preformas de soldadura
Folks, Rob heads to Guadalajara to solve the QFNvoiding problem…… As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexico) to help solve the voiding
QFN Reliability in SMT Electronics Assembly
Folks, Let's look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael.What a handful those two 18 month-olds were.Just like their mother!Rob was still pinching
Solder Powder: IPC “Type” and Surface Area
Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so
¿No está seguro de lo que necesita?
Déjenos ayudarle.
En Indium investigamos, desarrollamos y fabricamos materiales avanzados de ensamblaje electrónico para dar respuesta a los retos de hoy, de mañana y del futuro.

