部落格

使用波峰焊裝配 PCB 的人都知道，在熔融焊料的光滑表面上會聚集一層厚厚的金屬。

Folks, Rob heads to Guadalajara to solve the QFNvoiding problem…… As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexico) to help solve the voiding

Folks, Let's look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael.What a handful those two 18 month-olds were.Just like their mother!Rob was still pinching

Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so

各位，在最近的一篇文章中，我們討論到無鉛焊料較高的熔解溫度需要較高的回流焊接溫度，因此在無鉛焊接中需要使用較多的電力。

If you are left with an indium sulfamate plating bath or solution that you no longer use or need, you may have wondered what to do with it. It may be surprising to know that the indium plating bath

One of the first activities any child enjoys, once they can manipulate things, is usingpaints and crayons to color pictures.Stay with me: there's a reason for this introduction. In the lastsix

Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newest low temp metallization paste LT-918.Due to its

TypicalTabbing Ribbon Solders Only a few solder alloys have become common, industry-wide, among solarmodule assemblers, and those can be pared down into three categories: BiSn alloys (58Bi42Sn,

Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general

最近的測試結果顯示，焊錫助焊劑能夠應付高回流溫度 (>450°C) ，提供比預期更好的助焊劑殘留視覺效果！助焊劑在傳統上並不是

Solder starvation is a serious electronics assembly issue – with a very simple solution. Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped

Unbeknowst to me, the refrigerator where I store my solder paste and fluxes that I use for SIR (Surface Insulation Resistance) testing was being moved. One of my colleagues showed up at my desk with

Based on a recent post I published regarding the use of bismuth (Bi)in solder alloys, John writes: "If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t

Folks, A few people asked some questions after my last post on bismuth solders.Here they are: 1. The low melting point of these solders is encouraging.What are realistic field use conditions? Bismuth

Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that long), tin-bismuth solders were serious candidates.Their low melting point, of

Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other

Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin

ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the

I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of

Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and