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Riciclaggio delle scorie di saldatura
Chiunque abbia utilizzato la saldatura a onda per assemblare PCB conosce quello strato di metallo che si accumula sulla superficie liscia della saldatura fusa: si tratta di scorie di saldatura, composte da ossidati e da un'altra sostanza.
Risoluzione del problema del Voiding dei QFN con le preforme di saldatura
Folks, Rob heads to Guadalajara to solve the QFNvoiding problem…… As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexico) to help solve the voiding
QFN Reliability in SMT Electronics Assembly
Folks, Let's look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael.What a handful those two 18 month-olds were.Just like their mother!Rob was still pinching
Solder Powder: IPC “Type” and Surface Area
Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so
Uso di stagno e argento nell'elettronica dopo la RoHS
Gente, in un recente post abbiamo discusso del fatto che le temperature di fusione più elevate delle saldature senza piombo richiedono temperature di saldatura a riflusso più elevate, quindi viene utilizzata più elettricità nelle saldature senza piombo.
Il mio bagno di galvanizzazione al solfammato di indio, che non ho utilizzato, ha qualche valore?
If you are left with an indium sulfamate plating bath or solution that you no longer use or need, you may have wondered what to do with it. It may be surprising to know that the indium plating bath
Colored Fluxes: Not Child’s-Play
One of the first activities any child enjoys, once they can manipulate things, is usingpaints and crayons to color pictures.Stay with me: there's a reason for this introduction. In the lastsix
A New Low-Temperature Metallization Paste For Interconnecting Thin-Film Solar Cells
Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newest low temp metallization paste LT-918.Due to its
Lega di saldatura stagno-argento (SnAg) per il collegamento delle stringhe e delle barre collettrici dei moduli solari
TypicalTabbing Ribbon Solders Only a few solder alloys have become common, industry-wide, among solarmodule assemblers, and those can be pared down into three categories: BiSn alloys (58Bi42Sn,
SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate
Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general
Valutazione del flusso per il riflusso di saldatura ad alta temperatura di AuSn
Recent test results show that solder fluxes handle high reflow temperatures (>450°C), providing better-than-expected visual results of flux residue! Solder fluxes have not traditionally been
Solving Solder Starvation in SMT Electronics Assembly
Solder starvation is a serious electronics assembly issue – with a very simple solution. Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped
Humidity and Solder Paste Do Not Mix
Unbeknowst to me, the refrigerator where I store my solder paste and fluxes that I use for SIR (Surface Insulation Resistance) testing was being moved. One of my colleagues showed up at my desk with
Lead Use on the Rise, Bismuth Supplies Secure: Solder Alloy Considerations
Based on a recent post I published regarding the use of bismuth (Bi)in solder alloys, John writes: "If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t
Bismuth Solder Alloy Follow On
Folks, A few people asked some questions after my last post on bismuth solders.Here they are: 1. The low melting point of these solders is encouraging.What are realistic field use conditions? Bismuth
Has the Time Come for Tin-Bismuth Solders?
Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that long), tin-bismuth solders were serious candidates.Their low melting point, of
Qual è il modo migliore per saldare al Nitinol?
Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other
Alla ricerca dei difetti del baffo di stagno nella saldatura senza piombo
Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin
ITO (Indium-Tin Oxide) Sputtering Target Reclaim/Recycling
ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the
Elettromigrazione (EM) e migrazione elettrochimica (ECM)
I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of
Compatibility of Conformal Coatings versus No-Clean Solder Paste Flux Residues: When To Clean?
Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and
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In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.

