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Qual è il modo migliore per saldare al Nitinol?
Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other
Alla ricerca dei difetti del baffo di stagno nella saldatura senza piombo
Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin
ITO (Indium-Tin Oxide) Sputtering Target Reclaim/Recycling
ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the
Elettromigrazione (EM) e migrazione elettrochimica (ECM)
I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of
Compatibility of Conformal Coatings versus No-Clean Solder Paste Flux Residues: When To Clean?
Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and
Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have
It’s Wrong to Average or Add Cp and Cpk
Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick” of solder paste on the PWB pads. The product had
The Law of Exponential Profits
Folks, Let’s assume you are trying to improve the productivity of your SMT assembly lines. You work at a facility that manufactures high volume products with a high mix. The first aspect of your
The Conclusion of “Bob and Fred Breaks”
Folks, The conclusion of the Bob and Fred break saga…… Phil stared, “The uptime on AXI’s four SMT production lines is…….” Fred and Bob were waiting for the good news of
Continua la saga di Fred e Bob Breaks
(continued from previous post) “Fred break, Bob break?” Phil asked. Folks, The "Fred and Bob Breaks"saga continues, “Fred is the tech responsible for the stencil printer
Bob Breaks and Fred Breaks
Folks, Dr. Phil James, a former student of “The Professor”, gets a phone call, let’s listen in…… Phil James was staring out the window of his office in Exeter, NH.Fall
Transitioning from Water-Soluble Solder Paste Flux to No-Clean Solder Paste Flux
I just visited a customer that was converting from water soluble solder paste to no-clean. Not exactly a slam dunk transition as this customer found out. During my visit, solder balls and solder
La metallurgia come alchimia moderna: il bismuto
Sebbene la maggior parte degli scienziati oggi ritenga che l'alchimia sia stata ampiamente screditata, e a me è stato insegnato a essere d'accordo, l'idea di essa è stravagante e
Bismuto: Il mio nuovo amico
Ultimamente mi sono dedicato a diverse ricerche e uno dei miei argomenti preferiti sono le leghe per saldatura. Per molto tempo la maggior parte delle saldature (quasi tutte) è stata composta da stagno-piombo eutettico.
Understanding Thermal Resistance Calculations
I have previously discussed various reasons why thermal considerations in a device cannot be an afterthought.There are various methods for handling the thermal needs of a device before it becomes a
Gallium Solder Alloys: Questions & Answers
I’ve received numerous questions about using gallium liquid metal alloys, so thought I’d present some of my answers for all. The customerquestions are in black, and my responses in red.
Bumping di wafer e substrato con pasta saldante (II)
... e torniamo alla domanda: "Quanto è piccola la particella di polvere di saldatura di cui ho bisogno per ottenere una certa altezza o una certa protuberanza?
Bumping di wafer e substrato con pasta saldante (I)
L'argomento di questa settimana riguarda sia il bumping dei wafer che quello dei substrati con la pasta saldante e il problema della polvere.
SMT Soldering Reflow Profiling and Ramp Rates
Solder paste is made to be reflowed in the SMT process. Exactly HOW that is done is critical to your success. Included in the Product Data Sheet, among other things, are parameters which guide the
Soldering 101 CTE Mismatch
The Northeast USA (as well as other parts of the country) have been experiencing quite a warm summer. And, if walking out into the humidity wasn't clue enough, I would just have to test the fit
Patty e Rob hanno successo con due linee ad alto rendimento.
Folks, The adventures of Patty and Rob continue……. Rob bolted upright in bed. He had that terrible feeling that he had overslept for an important appointment. His eyes quickly found the
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In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.

