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Solder Paste and Flux Dip Depth: I

My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest

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땜납 드로스 재활용

웨이브 솔더링을 사용하여 PCB를 조립해 본 사람이라면 용융 솔더의 매끄러운 표면에 모이는 두툼한 금속 층에 대해 알고 있습니다. 이것은 솔더 드로스입니다.

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솔더 프리폼을 사용한 QFN 보이드 문제 해결

Folks, Rob heads to Guadalajara to solve the QFNvoiding problem…… As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexico) to help solve the voiding

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QFN Reliability in SMT Electronics Assembly

Folks, Let's look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael.What a handful those two 18 month-olds were.Just like their mother!Rob was still pinching

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Solder Powder: IPC “Type” and Surface Area

Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so

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RoHS 이후 전자제품의 주석 및 은 사용

여러분, 최근 포스팅에서 무연 솔더의 용융 온도가 높을수록 리플로 납땜 온도가 더 높아야 하므로 무연에 더 많은 전기가 사용된다고 설명했습니다.

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사용하지 않은 황산인듐 도금욕은 어떤 가치가 있을까요?

If you are left with an indium sulfamate plating bath or solution that you no longer use or need, you may have wondered what to do with it. It may be surprising to know that the indium plating bath

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Colored Fluxes: Not Child’s-Play

One of the first activities any child enjoys, once they can manipulate things, is usingpaints and crayons to color pictures.Stay with me: there's a reason for this introduction. In the lastsix

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박막 태양전지 상호 연결용 새로운 저온 메탈라이제이션 페이스트

지난주 저는 에릭 바스토우와 함께 첨단 소재 및 공정 개발 연구실에서 시간을 보내며, 당사의 최신 저온 금속화 페이스트인 LT-918의 인쇄 특성을 검증했습니다. 이 제품의

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태양광 모듈의 스트링 및 버스 배선용 주석-은(SnAg) 솔더 합금

TypicalTabbing Ribbon Solders Only a few solder alloys have become common, industry-wide, among solarmodule assemblers, and those can be pared down into three categories: BiSn alloys (58Bi42Sn,

지원

SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate

Included in a solder paste’s Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general

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AuSn 고온 솔더 리플로우를 위한 플럭스 평가

최근 테스트 결과에 따르면 솔더 플럭스는 높은 리플로우 온도(>450°C)를 처리하여 예상보다 우수한 시각적 플럭스 잔류물 결과를 제공합니다! 솔더 플럭스는 전통적으로

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Solving Solder Starvation in SMT Electronics Assembly

Solder starvation is a serious electronics assembly issue – with a very simple solution. Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped

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Humidity and Solder Paste Do Not Mix

Unbeknowst to me, the refrigerator where I store my solder paste and fluxes that I use for SIR (Surface Insulation Resistance) testing was being moved. One of my colleagues showed up at my desk with

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Lead Use on the Rise, Bismuth Supplies Secure: Solder Alloy Considerations

Based on a recent post I published regarding the use of bismuth (Bi)in solder alloys, John writes: "If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t

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Bismuth Solder Alloy Follow On

Folks, A few people asked some questions after my last post on bismuth solders.Here they are: 1. The low melting point of these solders is encouraging.What are realistic field use conditions? Bismuth

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Has the Time Come for Tin-Bismuth Solders?

Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that long), tin-bismuth solders were serious candidates.Their low melting point, of

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니티놀에 납땜하는 가장 좋은 방법은 무엇인가요?

Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other

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무연 납땜에서 실패한 주석 수염을 찾아서

Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin

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ITO(인듐-주석 산화물) 스퍼터링 타겟 회수/재활용

ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the

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전자 마이그레이션(EM) 및 전기 화학 마이그레이션(ECM)

I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of

Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.