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산화물을 제거하기 위한 인듐 에칭
인듐을 이용한 납땜 또는 습윤(코팅)과 관련하여 인듐의 산화물 형성 및 제거 방법에 대해 자주 문의를 받습니다. 또한 산화물이 생성되는 데 시간이 얼마나 걸리는지에 대한 질문도 받습니다.
Soldering to Stainless Steel
We are often asked if it is possible to solder to stainless steel and, if so, what is the best procedure.As you may already know, stainless steel is not easy to solder but it can be done with a
Soldering to Aluminum
We are frequently asked if it is possible to solder to aluminum.The answer is yes, if the following guidelines are followed: FLUXES: Because it is difficult to solder to aluminum, Indium Corporation
Patty Cost Analyzes an MRI scan
Folks, Let’s see how Patty is doing with the latest crisis…… Upon hearing Claire Perkins inform her that Rob was in the hospital, Patty froze and her face looked ashen.She quickly
Switching from High Lead Solders to Eutectic AuSn
Two categories of solder are available to choose from when the in-service environment for a device reaches above 125°C either in continuous operation or thermal cycling accelerated life
Patty Pitches NMAC/I/O
Folks, Patty arrived at work an hour early to prepare for her meeting with ACME CEO Mike Madigan.Nineteen days ago, he had asked her to develop an electronics assembly metric that would correlate
납땜의 인듐-구리 상호 금속 간 금속
Indium and indium-containing alloys see wide use in a multitude of soldering applications. Indium has many attractive properties such as remaining ductile at cryogenic temperatures, compatibility
솔더 조인트의 보이드 감소
It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is
냉간 용접 인듐 금속
인듐 금속은 상온에서 스스로를 냉간 용접(접합)하는 독특한 능력을 가지고 있습니다. 엄밀히 말하면 납땜은 아니지만, 이 특성 덕분에 저온 접합에 특히 유용합니다.
Tombstoning: The Death of a PCBA
Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as occurring when one end of a passive device, such as
패티, 궁극의 전자 조립 생산성 지표를 찾다
Folks, Let's look in on Patty…… Patty was just finishing a report on work that she and Pete had performed with a team of her ACME colleagues on reducing the Head-in-Pillow (HIP)
통계: 뉴올리언스의 0-11 코인 토스 손실은 얼마나 이례적인가?
Folks, In addition to electronics assembly productivity, solder paste and solder preform applications, and other electronics assembly concerns, many of you know that I teach statistics and have been
Solder Paste Expiration / Shelf Life
Solder paste is comprised of powdered solder alloy suspended in a flux vehicle. There is a group of flux ingredients that is generically identified as
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time… As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I were discussing some puzzling results for low
Intermetallics In Soldering
Intermetallics are a necessary evil in the metal-to-metal bonding world, which definitely includes soldering. There are two basic ways that metal will "chemically"bond to another metal: 1)
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest
땜납 드로스 재활용
웨이브 솔더링을 사용하여 PCB를 조립해 본 사람이라면 용융 솔더의 매끄러운 표면에 모이는 두툼한 금속 층에 대해 알고 있습니다. 이것은 솔더 드로스입니다.
솔더 프리폼을 사용한 QFN 보이드 문제 해결
Folks, Rob heads to Guadalajara to solve the QFNvoiding problem…… As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexico) to help solve the voiding
QFN Reliability in SMT Electronics Assembly
Folks, Let's look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael.What a handful those two 18 month-olds were.Just like their mother!Rob was still pinching
Solder Powder: IPC “Type” and Surface Area
Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so
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도와드리겠습니다.
Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.

