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Wie kann ich am besten an Nitinol löten?

Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other

Unterstützung

Auf der Suche nach Zinn-Whisker-Fehlern beim bleifreien Löten

Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin

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ITO (Indium-Tin Oxide) Sputtering Target Reclaim/Recycling

ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the

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Elektromigration (EM) und elektrochemische Migration (ECM)

I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of

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Compatibility of Conformal Coatings versus No-Clean Solder Paste Flux Residues: When To Clean?

Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and

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Epoxy Flux Dipping for CSP and PoP Applications

This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have

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It’s Wrong to Average or Add Cp and Cpk

Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick” of solder paste on the PWB pads. The product had

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The Law of Exponential Profits

Folks, Let’s assume you are trying to improve the productivity of your SMT assembly lines. You work at a facility that manufactures high volume products with a high mix. The first aspect of your

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The Conclusion of “Bob and Fred Breaks”

Folks, The conclusion of the Bob and Fred break saga…… Phil stared, “The uptime on AXI’s four SMT production lines is…….” Fred and Bob were waiting for the good news of

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Die Geschichte von Fred und Bob Breaks geht weiter

(continued from previous post) “Fred break, Bob break?” Phil asked. Folks, The "Fred and Bob Breaks"saga continues, “Fred is the tech responsible for the stencil printer

Unterstützung

Bob Breaks and Fred Breaks

Folks, Dr. Phil James, a former student of “The Professor”, gets a phone call, let’s listen in…… Phil James was staring out the window of his office in Exeter, NH.Fall

Unterstützung

Transitioning from Water-Soluble Solder Paste Flux to No-Clean Solder Paste Flux

I just visited a customer that was converting from water soluble solder paste to no-clean. Not exactly a slam dunk transition as this customer found out. During my visit, solder balls and solder

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Metallurgie als moderne Alchemie: Bismut

Obwohl die meisten Wissenschaftler heute der Meinung sind, dass die Alchemie weitgehend diskreditiert ist, und ich habe gelernt, dem zuzustimmen, ist die Vorstellung davon skurril und

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Wismut: Mein neuer Freund

In letzter Zeit habe ich viel recherchiert, eines meiner Lieblingsthemen sind Lötlegierungen. Lange Zeit bestand das meiste Lot (fast alles) aus eutektischem Zinn-Blei

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Understanding Thermal Resistance Calculations

I have previously discussed various reasons why thermal considerations in a device cannot be an afterthought.There are various methods for handling the thermal needs of a device before it becomes a

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Gallium Solder Alloys: Questions & Answers

I’ve received numerous questions about using gallium liquid metal alloys, so thought I’d present some of my answers for all. The customerquestions are in black, and my responses in red.

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Wafer- und Substrat-Bumping mit Lötpaste (II)

... und schon sind wir wieder bei der Frage: "Wie klein muss das Lotpulverteilchen sein, um eine bestimmte Bumphöhe oder Bump zu erreichen?

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Wafer- und Substrat-Bumping mit Lötpaste (I)

Diese Woche geht es um Wafer Bumping und Substrat Bumping mit Lötpaste sowie um die Frage der Pulver

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SMT-Löten, Reflow-Profilierung und Rampenraten

Solder paste is made to be reflowed in the SMT process. Exactly HOW that is done is critical to your success. Included in the Product Data Sheet, among other things, are parameters which guide the

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Löten 101 WAK-Fehlanpassung

The Northeast USA (as well as other parts of the country) have been experiencing quite a warm summer. And, if walking out into the humidity wasn't clue enough, I would just have to test the fit

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Patty und Rob haben Erfolg mit zwei Linien mit hoher Betriebszeit.

Folks, The adventures of Patty and Rob continue……. Rob bolted upright in bed. He had that terrible feeling that he had overslept for an important appointment. His eyes quickly found the

Bei Indium erforschen, entwickeln und produzieren wir fortschrittliche Materialien für die Elektronikmontage, die den Herausforderungen von heute, morgen und übermorgen gewachsen sind.