Products
SAFI-Tech® Supercool Technology
SAFI-Tech’s innovative supercooled solder pastes, developed by Indium Corporation, represent a cutting-edge yet familiar material for electronics assembly. Unlike traditional solder pastes, these utilize supercooled liquid metal particles, unlocking new possibilities for creating electronics with advanced properties previously constrained by manufacturing limitations. This breakthrough pushes the boundaries of functionality, enabling the development of more sophisticated and capable electronic devices.
Powered by Indium Corporation
- Enables Thinner, More Flexible Designs
- Reduces Cost of Ownership
- A Sustainable Solution
Product Overview
Advanced Materials
Engineers seeking advanced manufacturing solutions should consider integrating supercooled liquid metal pastes into their products. These innovative materials offer enhanced durability, flexibility, and thermal performance—qualities that traditional soldering methods often struggle to achieve due to heat constraints.
No Reflow
Removing heat from electronics manufacturing redefines design capabilities by enhancing miniaturization, enabling the use of desirable substrates and achieving the highest resolution prints.
Improved Yield
Minimizing the time spent in reflow ovens not only boosts volume throughput but also reduces the necessary size of the ovens themselves.
Sustainable
Reducing the temperature and time required in reflow ovens delivers significant energy savings while also reducing carbon emissions.
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