As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-Free circuit board assembly. We offer many different alloy choices and flux technologies to solve many process challenges.
|Leading Pb-Free Solder Pastes||No-Clean||SAC||Technology optimized for miniaturized electronics and HIP reduction.|
|Indium5.8LS||No-Clean||SAC||Halogen-Free technology designed for maximum paste print transfer efficiency and elimination of flux spattering.|
|Indium6.4R||Water Wash||SnPb||Lowest voiding water wash solder paste on the market.|
|Indium3.2||Water Wash||SAC||Technology for maximizing the process window with long stencil life and strong humidity resistance.|
|Indium3.2HF||Water Wash||SAC||Halogen-Free version of Indium3.2|
|Indium5.7LT||No-Clean||Bi/Sn||Low melting point solder paste with high reliability for use in temperature sensitive applications.|
|NC-SMQ80||No-Clean||In/Sn||Specialty solder paste for low temperature applications with high mechanical reliability.|
|Indium10.1HF||No-Clean||Air reflow, no-clean, halogen-free, specifically formulated with a flux chemistry.|
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LIVE@APEX features Solder Fortification® Preforms. This blog posts tells you how they can be used to resolve assembly issues such as solder starvation.
Indium Corporation is ready to help you Succeed at the Velocity of Technology at the APEX Expo 2018, booth 1625.
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an excellent visual aid that helps show the potential defect causes and the effects the process variables can have. This particular Ishikawa Diagram displayed that reflow profile can have a large effect on voiding. Today I will dig into this area a bit further and talk about how we can minimize large ground plane solder voiding in electronic assemblywith differences in reflow profile.
From One Engineer to Another®
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