Indium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
The first presentation, Reflow and Reliability of In-Ag Soldering Thermal Interface Material without Flux for TIM1 and TIM1.5 Applications, will be presentedby Senior Research Metallurgist Dr. Jie Geng. The presentation will focus on indium and indium alloys as TIMs for use in thermal management for high-performance computing and AI, specifically examining the influence of the different compositions of In-Ag alloys and reflow conditions on the voiding performance and interfacial intermetallic compounds in soldered joints.
The second presentation, Liquid Metal Paste Dispensing as a Thermal Interface Material for High-Performance Computing Applications, will be presented by Senior Product Development Specialist for Thermal Interface Materials Miloš Lazić. The presentation will explore a new category of liquid metal paste TIMs that combine gallium-based liquid metals with polymeric materials, referred to as polymer-liquid metal hybrids or polymeric liquid metal pastes, which are increasingly critical as electronic devices become smaller, more power-dense, and generate more heat.
The third presentation, Gallium Phase Change Metal Thermal Interface Material, will also be presented by Lazić. This presentation will examine comprehensive testing and results of a novel, patented, gallium-based phase change thermal interface material (PCTIM) that can provide greater thermal conductivity than organic or polymeric PCTIMs.
Lazić is co-chair of the symposium’s thermal materials track. The presentations will take place on Wednesday, October 1, from 9:30 a.m. to 10:55 a.m.
About the Speakers
- Lazić is responsible for developing new thermal materials and products, as well as providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products. He holds a bachelor’s degree in electrical engineering and a master’s degree in electronics engineering. Lazić is also certified as an energy efficiency engineer and SMT process engineer, and is fluent in English, Serbian, Croatian, and Bosnian.
- Dr. Geng joined Indium Corporation in 2017 and has more than 20 years of experience in materials science research and engineering. He holds a doctorate in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering with notable contributions to the development of Indalloy®292 and Durafuse® HR.
To learn more about Indium Corporation’s innovative TIMs solutions, visit https://www.indium.com/products/thermal-interface-materials/.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
