Indium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
The first presentation, Reflow and Reliability of In-Ag Soldering Thermal Interface Material without Flux for TIM1 and TIM1.5 Applications, will be presentedby Senior Research Metallurgist Dr. Jie Geng. The presentation will focus on indium and indium alloys as TIMs for use in thermal management for high-performance computing and AI, specifically examining the influence of the different compositions of In-Ag alloys and reflow conditions on the voiding performance and interfacial intermetallic compounds in soldered joints.
The second presentation, Liquid Metal Paste Dispensing as a Thermal Interface Material for High-Performance Computing Applications, will be presented by Senior Product Development Specialist for Thermal Interface Materials Miloš Lazić. The presentation will explore a new category of liquid metal paste TIMs that combine gallium-based liquid metals with polymeric materials, referred to as polymer-liquid metal hybrids or polymeric liquid metal pastes, which are increasingly critical as electronic devices become smaller, more power-dense, and generate more heat.
The third presentation, Gallium Phase Change Metal Thermal Interface Material, will also be presented by Lazić. This presentation will examine comprehensive testing and results of a novel, patented, gallium-based phase change thermal interface material (PCTIM) that can provide greater thermal conductivity than organic or polymeric PCTIMs.
Lazić is co-chair of the symposium’s thermal materials track. The presentations will take place on Wednesday, October 1, from 9:30 a.m. to 10:55 a.m.
关于演讲者
- Lazić is responsible for developing new thermal materials and products, as well as providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products. He holds a bachelor’s degree in electrical engineering and a master’s degree in electronics engineering. Lazić is also certified as an energy efficiency engineer and SMT process engineer, and is fluent in English, Serbian, Croatian, and Bosnian.
- 耿博士于2017年加入铟泰公司 ，在材料科学研究与工程领域拥有20余年的经验。他拥有冶金学博士学位、材料科学硕士学位以及材料科学与工程学士学位，并在Indalloy®292和Durafuse®HR的开发方面做出了显著贡献。
To learn more about Indium Corporation’s innovative TIMs solutions, visit https://www.indium.com/products/thermal-interface-materials/.
关于铟泰铟泰公司
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
