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Indium metal will ‘adhere’ to itself at room temperature. Many materials will cold weld with enough force, but indium is unique in that it can bond to itself with very little

College intern season is here! In the coming days Indium Corporation will begin advertising job postings for our highly competitive 2017 Summer College Internship program. This year wewill

Compared to traditional solders (23-50W/(m*K)), pure indium metal has a much higher rate of thermal transfer (86W/(m*K)). Combined with its remarkable softness, you can use pure indium to form a good

It is easy to get burned during the burn-in and test process if you don't use the right thermal interface

This is the last in a series of posts that discusses reinforced Solder Preforms for high–reliability and low voiding. This post will focus on the results of our DOE to find out if we did, in

Probe testability is the last of the IPC tests. This test measures the nature of the flux residue to determine whether it interferes with the post-soldering electronic probe testing of the circuit

This is the fourth in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low

Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. Fluxes should facilitate soldering, but not degrade the circuit by

Many of the alloys we work with in our solder preform manufacturing operation can have various physical properties based on how we work with them. Transforming ingots of metal into precision preforms

This is the third in a series of blog posts that talk about reinforced Solder Preforms for high–reliability and low voiding. This post will focus on how InFORMS® affect bondline consistency

Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she

Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach

This is the second in a series of blog posts that talks about Reinforced Solder Preforms for High–Reliability and Low Voiding. This post will focus on the technology advancement of InFORMS®

The corrosion test, also called the “copper mirror test,” differs from the copper coupon test because it qualitatively determines the corrosivity of the flux before reflow rather than

Indiumreadily forms a compound with thechloride ionto formInCl3 whichis the most available and readily soluble indium salt.It is available in aqueous solution and anhydrous forms. With such

Indium rod is essentially very thick indium wire, so we don’t end up talking about it often specifically. I guess we take it for granted – but we do provide indium rod to our customers.

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

Solder mask on PCBs is applied to keep solder off of areas around the printed circuit board’s contacts, using the principal that solder will not bond to non-metallic

Phil Zarrow: Brook, Indium Corporation's been doing some extensive testing on the effect of different process variables on voiding and

Indium recovery refers to the salvage (extraction) of indium metal from various indium-contained products or processes that consume the material (sealing, deposition, plating, etc.). This is

As promised, here are some excerpts from a paper that I co-authored with my colleagues, Tim Jensen and Sunny Neoh. Tim recently presented this paper at SMTA PanPac. The paper discusses how