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ワイヤーをパッドにはんだ付けする方法
かなり簡単なことのように思える。パッドにワイヤーをハンダ付けすることのどこが難しいのだろうか?さて、私は3つのよくある不満や表現を耳にする:位置決め:一般的に
Optical Activation of NanoFoil®
Lasers and fiber optic waveguides can be used to activate NanoFoil®. Why would you want to use a laser to do this? It lends itself to automation: Imagine a part moving into position, the laser
Can Your Mortality Be Modelled with The Weibull Distribution?
Folks, In the last posting, we saw how Weibull analysis helped us to determine that SACm® lead-free solder (SAC105 with about 0.1% manganese) has comparable (actually better) thermal cycle
Weibull Analysis of Solder Joint Failure Data II
Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let's now derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the
Indium Seals
Due to its softness and compressibility, indium is ideal for use in creating a seal. Let's get right into it: Indium preforms are commonly used to create seals. The preforms are made into an
鉛含有および鉛フリーはんだ接合部の電子機器故障解析
Folks, The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints. It is the first thought of someone trying to model thermal
Statistically Significant vs Practically Significant Results in SMT Assembly
Folks, Everyday, we are exposed to the results of surveys and polls. A typical example might be that President Obama is leading Mitt Romney in a poll by 48% to 45%, but the results are not
A Look Inside the Solder Flux Pen
Here is a picture of an Indium Corporation solder flux pen, sectioned to show you the internals. Who DOESN'T want to see THAT, right?!? Flux pens are commonly used to accurately supply small
生産性は必ず報われる
Folks, Let’s see how Patty and Pete are making out on their latest adventure…. “Here is the ProfitPro™ output,” Dave Ferris said as he pointed to a PowerPoint slide on the
はんだペーストの使用量の算出
特定の回路基板や量産ロット全体に必要なはんだペーストの正確な量を算出することは、以下の理由などにより困難な場合があります。具体的には、印刷量のばらつきや、基板上に残留したペーストなどが挙げられます。
A Penny per Gram
Folks, It has been a while, let’s look in on Patty…… Patty had to admit that she was very fortunate. She had yet to turn 30 and she was a Senior Vice President at ACME. There was
Cleaning No-Clean Solder Paste Residues in SMT Assembly
Folks, There is a lot of interest in cleaning PCBs that have been assembled with no-clean solder pastes. Recently I discussed the topic with my good friend Mike Bixenman of Kyzen. Dr. Ron (DR) Mike,
水洗はんだペースト用フラックスのSIRおよびECM試験
It is not often that we get a request for SIR (Surface Insulation Resistance) and/or ECM (Electro-Chemical Migration) results for a water washable/soluble flux or solder paste, but often enough to
Advantages of Rotary Sputtering Targets vs. Planar Sputtering Targets
I have been asked to explain why someone would want to use rotary sputtering targets instead of planar sputtering
錫ウィスカー、はんだ合金密度、安全性:コメント
Folks, Some time ago I wrote a post, “In Search of Tin Whiskers,” Michael responds below. He makes some good points. Dr. Ron, I'm responding to your blog regarding tin
Cost of Ownership vs Profit Potential In Electronics Assembly
Folks, Let’s look in on Patty and Pete and see how they are handling Rex “The Torrent.” Patty wanted to give Pete a little more exposure so she nodded to him to chime
Patty Presents Her Electronics Assembly Copy Exactly Strategy
Folks, Patty is getting ready for her meeting on "Copy Exactly" with Mike Madigan……. It was after 6:30 PM and Patty was just arriving home. Since Patty was working late, Rob had
Is Lowest “Cost of Ownership” the Best Electronics Assembly Manufacturing Metric?
Folks, Let’s look in on Patty and her colleagues…… Sam Watkins, ACME New Hampshire site GM, had just finished meeting with his boss, ACME CEO Mike Madigan. He was embarrassed that
Effecting And Evaluating Tabbing Ribbon Bond Strength, Reliability, And Performance
Readers have asked how to visually assess a tabbing ribbon interconnection after a bond test. This image is a cell that has been bond tested after soldering. The first indication that you have a good
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インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。

