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Cost of Ownership vs Profit Potential In Electronics Assembly

Folks, Let’s look in on Patty and Pete and see how they are handling Rex “The Torrent.” Patty wanted to give Pete a little more exposure so she nodded to him to chime

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Patty Presents Her Electronics Assembly Copy Exactly Strategy

Folks, Patty is getting ready for her meeting on "Copy Exactly" with Mike Madigan……. It was after 6:30 PM and Patty was just arriving home. Since Patty was working late, Rob had

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Is Lowest “Cost of Ownership” the Best Electronics Assembly Manufacturing Metric?

Folks, Let’s look in on Patty and her colleagues…… Sam Watkins, ACME New Hampshire site GM, had just finished meeting with his boss, ACME CEO Mike Madigan. He was embarrassed that

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Effecting And Evaluating Tabbing Ribbon Bond Strength, Reliability, And Performance

Readers have asked how to visually assess a tabbing ribbon interconnection after a bond test. This image is a cell that has been bond tested after soldering. The first indication that you have a good

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酸化物を除去するためのインジウムのエッチング

インジウムのはんだ付けやウェッティング(コーティング)に関して、インジウムの酸化物の形成とその除去方法についてコメントを求められることがよくあります。また、酸化物が生成されるまでにどれくらいの時間がかかるかという質問もあります。

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Soldering to Stainless Steel

We are often asked if it is possible to solder to stainless steel and, if so, what is the best procedure.As you may already know, stainless steel is not easy to solder but it can be done with a

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Soldering to Aluminum

We are frequently asked if it is possible to solder to aluminum.The answer is yes, if the following guidelines are followed: FLUXES: Because it is difficult to solder to aluminum, Indium Corporation

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パティがMRI画像のコスト分析を行う

Folks, Let’s see how Patty is doing with the latest crisis…… Upon hearing Claire Perkins inform her that Rob was in the hospital, Patty froze and her face looked ashen.She quickly

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高鉛はんだから共晶AuSnへの切り替え

Two categories of solder are available to choose from when the in-service environment for a device reaches above 125°C either in continuous operation or thermal cycling accelerated life

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Patty Pitches NMAC/I/O

Folks, Patty arrived at work an hour early to prepare for her meeting with ACME CEO Mike Madigan.Nineteen days ago, he had asked her to develop an electronics assembly metric that would correlate

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はんだ付けにおけるインジウム-銅金属間化合物

Indium and indium-containing alloys see wide use in a multitude of soldering applications. Indium has many attractive properties such as remaining ductile at cryogenic temperatures, compatibility

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はんだ接合部のボイド低減

It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is

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インジウム金属の冷間溶接

インジウム金属は、室温でそれ自身を冷間溶接(接合)するユニークな能力を持っている。これは厳密にははんだ付けではないが、この特性により低温接合に特に有用である。

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Tombstoning: The Death of a PCBA

Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as occurring when one end of a passive device, such as

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Patty Seeks the Ultimate Electronics Assembly Productivity Metric

Folks, Let's look in on Patty…… Patty was just finishing a report on work that she and Pete had performed with a team of her ACME colleagues on reducing the Head-in-Pillow (HIP)

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太陽電池モジュール組立における手はんだ付けの推奨

ここでは、シリコン系太陽電池の手はんだ付け(および他のアプリケーションの手はんだ付け)中に発生する可能性のある問題を克服するのに役立つトリックのリストを示します。

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統計学ニューオーリンズの0-11コイントス負けはいかに異常か?

Folks, In addition to electronics assembly productivity, solder paste and solder preform applications, and other electronics assembly concerns, many of you know that I teach statistics and have been

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Solder Paste Expiration / Shelf Life

Solder paste is comprised of powdered solder alloy suspended in a flux vehicle. There is a group of flux ingredients that is generically identified as

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Solder Paste and Flux Dip Depth: II

Following on from our discussions of last time… As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I were discussing some puzzling results for low

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はんだ付けにおける金属間化合物

Intermetallics are a necessary evil in the metal-to-metal bonding world, which definitely includes soldering. There are two basic ways that metal will "chemically"bond to another metal: 1)

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Solder Paste and Flux Dip Depth: I

My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest

インジウムでは、今日、明日、そして未来の課題に対する高度なエレクトロニクス組立材料のソリューションを研究、開発、製造しています。