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Statistiques : Dans quelle mesure la défaite 0-11 de la Nouvelle-Orléans à l'issue d'un tirage au sort est-elle inhabituelle ?
Folks, In addition to electronics assembly productivity, solder paste and solder preform applications, and other electronics assembly concerns, many of you know that I teach statistics and have been
Pâte à braser Expiration / Durée de conservation
Solder paste is comprised of powdered solder alloy suspended in a flux vehicle. There is a group of flux ingredients that is generically identified as
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time… As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I were discussing some puzzling results for low
Les intermétalliques dans le brasage
Intermetallics are a necessary evil in the metal-to-metal bonding world, which definitely includes soldering. There are two basic ways that metal will "chemically"bond to another metal: 1)
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest
Recyclage des crasses de soudure
Tous ceux qui ont utilisé la soudure à la vague pour assembler des circuits imprimés connaissent cette couche épaisse de métal qui s'accumule sur la surface lisse de la soudure en fusion.
Résoudre le problème du vide dans les QFN avec des préformes de soudure
Folks, Rob heads to Guadalajara to solve the QFNvoiding problem…… As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexico) to help solve the voiding
QFN Reliability in SMT Electronics Assembly
Folks, Let's look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael.What a handful those two 18 month-olds were.Just like their mother!Rob was still pinching
Solder Powder: IPC “Type” and Surface Area
Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so
Utilisation de l'étain et de l'argent dans l'électronique après la directive RoHS
Dans un article récent, nous avons expliqué que les températures de fusion plus élevées des soudures sans plomb impliquent des températures de soudure par refusion plus élevées, ce qui entraîne une plus grande consommation d'électricité dans les soudures sans plomb.
Is my unused indium sulfamate plating bath worth anything?
If you are left with an indium sulfamate plating bath or solution that you no longer use or need, you may have wondered what to do with it. It may be surprising to know that the indium plating bath
Colored Fluxes: Not Child’s-Play
One of the first activities any child enjoys, once they can manipulate things, is usingpaints and crayons to color pictures.Stay with me: there's a reason for this introduction. In the lastsix
A New Low-Temperature Metallization Paste For Interconnecting Thin-Film Solar Cells
Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newest low temp metallization paste LT-918.Due to its
Alliage de soudure étain-argent (SnAg) pour l'enfilage et la mise en bus de modules solaires
TypicalTabbing Ribbon Solders Only a few solder alloys have become common, industry-wide, among solarmodule assemblers, and those can be pared down into three categories: BiSn alloys (58Bi42Sn,
SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate
Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general
Évaluation du flux pour la refusion de soudure à haute température de l'AuSn
Les résultats de tests récents montrent que les flux de soudure supportent des températures de refusion élevées (>450°C) et donnent des résultats visuels de résidus de flux meilleurs que prévu ! Les flux de soudure n'ont pas été traditionnellement
Solving Solder Starvation in SMT Electronics Assembly
Solder starvation is a serious electronics assembly issue – with a very simple solution. Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped
Humidity and Solder Paste Do Not Mix
Unbeknowst to me, the refrigerator where I store my solder paste and fluxes that I use for SIR (Surface Insulation Resistance) testing was being moved. One of my colleagues showed up at my desk with
Lead Use on the Rise, Bismuth Supplies Secure: Solder Alloy Considerations
Based on a recent post I published regarding the use of bismuth (Bi)in solder alloys, John writes: "If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t
Bismuth Solder Alloy Follow On
Folks, A few people asked some questions after my last post on bismuth solders.Here they are: 1. The low melting point of these solders is encouraging.What are realistic field use conditions? Bismuth
Has the Time Come for Tin-Bismuth Solders?
Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that long), tin-bismuth solders were serious candidates.Their low melting point, of
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Chez Indium, nous recherchons, développons et fabriquons des matériaux d'assemblage électroniques avancés pour répondre aux défis d'aujourd'hui, de demain et de l'avenir.