部落格

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Cost of Ownership vs Profit Potential In Electronics Assembly

Folks, Let’s look in on Patty and Pete and see how they are handling Rex “The Torrent.” Patty wanted to give Pete a little more exposure so she nodded to him to chime

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Patty Presents Her Electronics Assembly Copy Exactly Strategy

Folks, Patty is getting ready for her meeting on "Copy Exactly" with Mike Madigan……. It was after 6:30 PM and Patty was just arriving home. Since Patty was working late, Rob had

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Is Lowest “Cost of Ownership” the Best Electronics Assembly Manufacturing Metric?

Folks, Let’s look in on Patty and her colleagues…… Sam Watkins, ACME New Hampshire site GM, had just finished meeting with his boss, ACME CEO Mike Madigan. He was embarrassed that

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Effecting And Evaluating Tabbing Ribbon Bond Strength, Reliability, And Performance

Readers have asked how to visually assess a tabbing ribbon interconnection after a bond test. This image is a cell that has been bond tested after soldering. The first indication that you have a good

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蝕刻铟以去除氧化物

關於使用铟進行焊接或潤濕(塗層),我們經常被要求就铟的氧化物形成以及如何去除氧化物提出意見。我們也會被問到氧化物的形成需要多長時間。

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Soldering to Stainless Steel

We are often asked if it is possible to solder to stainless steel and, if so, what is the best procedure.As you may already know, stainless steel is not easy to solder but it can be done with a

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Soldering to Aluminum

We are frequently asked if it is possible to solder to aluminum.The answer is yes, if the following guidelines are followed: FLUXES: Because it is difficult to solder to aluminum, Indium Corporation

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Patty Cost Analyzes an MRI scan

Folks, Let’s see how Patty is doing with the latest crisis…… Upon hearing Claire Perkins inform her that Rob was in the hospital, Patty froze and her face looked ashen.She quickly

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Switching from High Lead Solders to Eutectic AuSn

Two categories of solder are available to choose from when the in-service environment for a device reaches above 125°C either in continuous operation or thermal cycling accelerated life

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Patty Pitches NMAC/I/O

Folks, Patty arrived at work an hour early to prepare for her meeting with ACME CEO Mike Madigan.Nineteen days ago, he had asked her to develop an electronics assembly metric that would correlate

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錫銅間金屬在焊接中的應用

Indium and indium-containing alloys see wide use in a multitude of soldering applications. Indium has many attractive properties such as remaining ductile at cryogenic temperatures, compatibility

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減少焊點的空洞

It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is

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冷焊金屬铟

金屬铟具有在室溫下與自身冷焊(結合)的獨特能力。雖然嚴格來說,這並非焊接,但此特性使其特別適用於低溫接合。

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Tombstoning: The Death of a PCBA

Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as occurring when one end of a passive device, such as

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Patty 尋求終極電子組裝生產力指標

Folks, Let's look in on Patty…… Patty was just finishing a report on work that she and Pete had performed with a team of her ACME colleagues on reducing the Head-in-Pillow (HIP)

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太陽能模組組裝的手工焊接建議

以下是一份技巧清單,可協助您克服手工焊接矽基太陽能電池時可能發生的問題(以及其他應用,例如

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統計資料:新奧爾良 0-11 投幣失利有多不尋常?

Folks, In addition to electronics assembly productivity, solder paste and solder preform applications, and other electronics assembly concerns, many of you know that I teach statistics and have been

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Solder Paste Expiration / Shelf Life

Solder paste is comprised of powdered solder alloy suspended in a flux vehicle. There is a group of flux ingredients that is generically identified as

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焊膏與助焊劑浸漬深度:II

延續上次的討論……正如各位從先前關於這個主題的貼文中所記得的,我的朋友兼同事克里斯·納什(Chris Nash)和我當時正在討論一些關於低……的令人費解的結果

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Intermetallics In Soldering

Intermetallics are a necessary evil in the metal-to-metal bonding world, which definitely includes soldering. There are two basic ways that metal will "chemically"bond to another metal: 1)

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Solder Paste and Flux Dip Depth: I

My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。