Gold Solder
Gold Alloy Solder Paste
Gold-tin solder paste is used in a variety of applications that require a melting temperature over 150°C, good thermal fatigue properties, and high-temperature strength. It is widely used in military, aerospace, high-power LED, and medical applications.
Powered by Indium Corporation
- Superior Thermal Conductivity
- Good Joint Strength
- Excellent Wetting Properties
Product Overview
Gold-Tin (AuSn) Alloy Solder Solutions
Indium Corporation offers a comprehensive range of gold-tin (AuSn) alloys, including:
- 80Au20Sn
- 79Au21Sn
- 78Au22Sn
- 77Au23Sn
These alloys are ideal for high-reliability applications requiring excellent performance, thermal conductivity, and durability.
Particle Size & Metal Loading
Gold-tin solder paste is offered in powder sizes ranging from 2 to 7 C. Metal loadings vary between 91% to 94%, depending on the desired application method and particle size.
Flux Options for AuSn Solder Paste
Our gold-tin alloy solder paste is available with a variety of flux vehicles to meet specific application needs:
No-Clean Flux:
- AuLTRA® 5.1 (used in high-power LED and MEMs applications)
- AuLTRA® 5.1LS (utmost slump resistance)
- Indium10.8HF (accommodates higher processing temperatures required by the electronics industry)
- RMA-SMQ51A (for difficult to solder surfaces in die-attach)
- NC-SMQ75 (halogen-free and low-residue; requires <10 ppm oxygen)
Water-Wash Flux:
- AuLTRA® 3.2 (used in high-power LED applications)
- Indium3.2HF
Packaging Options
Our gold-tin solder paste is available in convenient packaging options, including:
- 10 cc and 30 cc syringes for easy dispensing
- Custom packaging available upon request
Gold Alloy Solder Paste Products
Our gold solder portfolio includes wire, paste, preforms, and ribbon. They are manufactured with cutting-edge technology to ensure quality as well as push the boundaries of precision.
AuLTRA® 3.2
AuLTRA® 3.2 gold-tin solder paste: reliable, low-void joints, easy
AuLTRA® 5.1
No-clean solder paste ensures high-temp, precise assembly, and
Product Data Sheets
AuLTRA® 5.1 AuSn No-Clean Solder Paste PDS 99987 (A4) R2.pdf
AuLTRA® 5.1 AuSn No-Clean Solder Paste PDS 99987 R2.pdf
AuLTRA® 5.1LS Low-Slump AuSn No-Clean Solder Paste PDS 100153 (A4) R0.pdf
AuLTRA® 5.1LS Low-Slump AuSn No-Clean Solder Paste PDS 100153 R0.pdf
Related Applications
Gold alloy solder pastes are available for use in a variety of applications.
High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
High-Reliability
Various options for various high-reliability PCBA
Die-Attach
Die-attach solutions include solder pastes to gold-based
Related Markets
Indium Corporation is a leading gold solder innovator that provides high-temperature, high-reliability, and critical applications such as die-attach and hermetic sealing to the following areas:
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Gold Alloy Preforms
High-performance precision gold preforms with eutectic and off-eutectic options
Gold-Alloy Ribbon
Durable, high-performance gold-alloy ribbon for precision
Expert Support for Reliable Results
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