March 16, 2017
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at ICEP 2017 on April 19-22 in Tendo, Japan.
Lim’s presentation, Benchmarking Study for High-Temperature and High-Reliability Pb-Free Die-Attach Material Technologies and Expectations, will discuss the results of an industry-wide survey initiated by iNEMI. The survey was designed to benchmark the availability of high-temperature Pb-free die-attach materials, the technological feasibility for the same, and ongoing industrial trends. Lim will detail survey insights on industrial preferences and outline potential lead-free materials.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
