Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at ICEP 2017 on April 19-22 in Tendo, Japan.
Lim’s presentation, Benchmarking Study for High-Temperature and High-Reliability Pb-Free Die-Attach Material Technologies and Expectations, will discuss the results of an industry-wide survey initiated by iNEMI. The survey was designed to benchmark the availability of high-temperature Pb-free die-attach materials, the technological feasibility for the same, and ongoing industrial trends. Lim will detail survey insights on industrial preferences and outline potential lead-free materials.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
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