Indium Corporation’s Dr. Yan Liu, Research Chemist, will present at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.
Dr. Liu’s presentation, Challenges of Ball-Attach Process Using Flux for Fan-Out Wafer/Panel-Level Packaging, discusses the increasing popularity of fan-out wafer-level packaging (FOWLP) and panel-level packaging (PLP) in the semiconductor industry. FOWLP and PLP have potential advantages, including cost reduction, when compared to conventional flip-chip packages and alternative forms of heterogeneous device integration, such as system-in-package. However, one key challenge when using these substrates is warpage of the reconstituted carrier. Dr. Liu will explore various aspects of flux properties that should be considered when choosing a flux to improve yields in regard to these warpage issues.
Dr. Liu’s areas of expertise include the development of fluxes and solder pastes for both traditional and 3D SMT applications. In addition, she has developed advanced materials for semiconductor applications, such as BGA and flip-chip attachment, wire bonding, and, most recently, Cu-pillar. Dr. Liu has also explored solder materials for LED applications, and her current research emphasizes solder materials for high-end 3D packaging. Dr. Liu joined Indium Corporation in 2001.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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