Two Indium Corporation experts are set to deliver technical presentations at the Productronica Forum on November 15 in Munich, Germany. The focus of the Forum is on trends and game changers for the SMT industryfrom Industry 4.0 to artificial intelligence.
At 10 a.m. local time, Regional Technical Manager and Technologist Advanced Applications Andreas Karch will deliver a presentation titled Innovative Solder Materials Specifically Engineered to Reduce Energy Consumption and CO2, which explores the relationship between the material properties of electronic components and reflow properties of solder materials used for PCB assembly. Additionally, it demonstrates the energy saving potential of using new low melting solder materials.
At 2:30 p.m. local time, Technical Manager for Europe, Africa, and the Middle East Karthik Vijay‘s presentation, e-Mobility & Harsher Mission Profiles: Engineered Solder Alloys for Increased Reliability, will analyze harsher mission profiles with higher operating temperatures (125-150C) and increased thermal cycles (3,000+) in e-mobility applications, such as electrification, ADAS, V2X. An innovative high-reliability automotive grade solder system with mixed alloy technology was designed to specifically address (a) low voiding <20% and eliminate the additional costs associated with vacuum technology; (b) maximize solder joint reliability for harsher mission profiles (higher operating temperatures of 125-150C, and increased thermal cycles that exceed 3,000 cycles.
Andreas ricopre il ruolo di Tecnologo per le Applicazioni Avanzate e Responsabile Tecnico per Germania, Austria e Svizzera presso Indium Corporation. Vanta oltre 20 anni di esperienza nel settore dell’elettronica automobilistica e dell’elettronica di potenza, compreso lo sviluppo di soluzioni avanzate su misura. Nel 2014 l’Ufficio austriaco dei brevetti gli ha conferito il premio “Inventum” per il suo brevetto relativo a un innovativo sistema di illuminazione a LED per autoveicoli, classificandolo tra i primi dieci candidati. È ingegnere di sviluppo certificato ECQA e ha conseguito la certificazione Six Sigma Yellow Belt.
Karthik heads the applications engineering team for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials. He has more than 20 years of experience in electronics assembly and a master’s degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering. Karthik is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitateil sito indiumstg.wpenginepowered.como inviate un’e-maila Jingya Huang. Potete inoltre seguire i nostri esperti di “From One Engineer To Another”(#FOETA) all’indirizzowww.linkedin.com/company/indium-corporation/.
