Two Indium Corporation experts are set to deliver technical presentations at the Productronica Forum on November 15 in Munich, Germany. The focus of the Forum is on trends and game changers for the SMT industryfrom Industry 4.0 to artificial intelligence.
At 10 a.m. local time, Regional Technical Manager and Technologist Advanced Applications Andreas Karch will deliver a presentation titled Innovative Solder Materials Specifically Engineered to Reduce Energy Consumption and CO2, which explores the relationship between the material properties of electronic components and reflow properties of solder materials used for PCB assembly. Additionally, it demonstrates the energy saving potential of using new low melting solder materials.
At 2:30 p.m. local time, Technical Manager for Europe, Africa, and the Middle East Karthik Vijay‘s presentation, e-Mobility & Harsher Mission Profiles: Engineered Solder Alloys for Increased Reliability, will analyze harsher mission profiles with higher operating temperatures (125-150C) and increased thermal cycles (3,000+) in e-mobility applications, such as electrification, ADAS, V2X. An innovative high-reliability automotive grade solder system with mixed alloy technology was designed to specifically address (a) low voiding <20% and eliminate the additional costs associated with vacuum technology; (b) maximize solder joint reliability for harsher mission profiles (higher operating temperatures of 125-150C, and increased thermal cycles that exceed 3,000 cycles.
Andreas serves as Technologist Advanced Applications and Technical Manager for Germany, Austria, and Switzerland for Indium Corporation. He has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovate LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
Karthik heads the applications engineering team for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics with a focus on the use of different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials. He has more than 20 years of experience in electronics assembly and a master’s degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering. Karthik is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
