Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.
Sze Pei’s presentation, Optimizing Void Performance of QFN Assembly, explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.
Sze Pei is responsible for managing Indium Corporation’s technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an Area Technical Manager. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.
The SMTA Penang Chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA Local Chapters plan events serving regional networks of industry professionals. For information on upcoming expos, visit their website at www.smta.org/expos.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected].
