Indium Corporation will feature products from its SiP portfolio at SiP Conference China, May 21, Shanghai, China.
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications. Those products include:
- SiPaste ultrafine-pitch solder paste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void, reduce slumps, and demonstrate consistent superior printing performance. SiPaste C201HF is specifically formulated to accommodate fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. Additionally, SiPaste 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules.
- WS-446HF ball-attach and flip-chip flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step, for both ball grid array (BGA) ball-attach and flip-chip processes.
- WS-823 ball-attach flux is a proven one-step BGA ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. Its unique formulation provides excellent solderability on a wide range of surfaces, uniform pin transfer over extended periods, and low-voiding.
- WS-829 wafer-level ball-attach flux is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard BGA manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging.
Indium Corporation also offers a wide array of proven no-clean fluxes designed for todays industry challenges, such as electronics devices in applications from the Internet of Things (IoT) to mobile devices and next-generation applications.
For more information on Indium Corporations ultra-low residue fluxes, visit indiumstg.wpenginepowered.com/fluxes or visit Indium Corporations booth at the show.
Informazioni su Indium Corporation
Indium Corporation è un’azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell’elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti; leghe per brasatura; materiali di interfaccia termica; bersagli per sputtering; metalli e composti inorganici di indio, gallio, germanio e stagno; e NanoFoil. Fondata nel 1934, l’azienda dispone di un’assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitate il sito indiumstg.wpenginepowered.com o inviate un’e-mail a Jingya Huang. Potete inoltre seguire i nostri esperti, From One Engineer To Another (#FOETA), su www.linkedin.com/company/indium-corporation/or @IndiumCorp.
Conferenza SiP in Cina
SiP Conference China is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise, and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies, and silicon foundries, as well as material and equipment suppliers.
