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Indium Corporation will observe the 15th anniversary of its “Live@APEX” program in 2019, featuring its proven products live on the show floor throughout IPC APEX

Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s

Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China. Chen will present on the topic

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming,

Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48th NEPCON Japan, Jan. 16-18 in Tokyo, Japan. Indium Corporation's AuSn

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California,

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at the ELEXCON 2018,

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference,

Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ®75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21 in Hefei, Anhui, China.

Indium Corporation’s, Dr. HongWen Zhang, Manager, R&D Alloy Group, will present at China Semiconductor Packaging Test Seminar (CSPT) 2018 from Nov. 19-21 in Hefei, Anhui, China. It is

Indium Corporation will help attendees Avoid the Void® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov.

Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 20th Electronics Packaging Technology

Indium Corporation expert Iván Castellanos, Technical Services Manager, Latin America, will teach two SMTA Certification courses on SMT Processes this fall.  

Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.

Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her industry knowledge and expertise at Minor Metals Trade Association (MMTA) China Minor Metals

Indium Corporation was recognized at SMTA International 2018 in Rosemont, Ill., with two awards from the Surface Mount Technology Association (SMTA) for their contributions to the industry. Indium

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer and PCB Assembly Materials Specialist, will present at the SMTA Ohio Valley Solder Roundtable on November 6 at

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International Wafer-Level