Pressemitteilungen

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48th NEPCON Japan, Jan. 16-18 in Tokyo, Japan. Indium Corporation's AuSn

Die Indium Corporation wird auf der IPC APEX EXPO 2019, die vom 29. bis 31. Januar in San Diego, Kalifornien, stattfindet, ihre hochzuverlässige Indium8.9HF-Lötpastenserie vorstellen,

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at the ELEXCON 2018,

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference,

Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ®75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21 in Hefei, Anhui, China.

Indium Corporation’s, Dr. HongWen Zhang, Manager, R&D Alloy Group, will present at China Semiconductor Packaging Test Seminar (CSPT) 2018 from Nov. 19-21 in Hefei, Anhui, China. It is

Indium Corporation will help attendees Avoid the Void® by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, Nov.

Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 20th Electronics Packaging Technology

Indium Corporation expert Iván Castellanos, Technical Services Manager, Latin America, will teach two SMTA Certification courses on SMT Processes this fall.  

Indium Corporation will feature its high-temperature solder paste, BiAgX® at the China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov. 19-21, in Hefei, Anhui, China.

Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her industry knowledge and expertise at Minor Metals Trade Association (MMTA) China Minor Metals

Indium Corporation was recognized at SMTA International 2018 in Rosemont, Ill., with two awards from the Surface Mount Technology Association (SMTA) for their contributions to the industry. Indium

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer and PCB Assembly Materials Specialist, will present at the SMTA Ohio Valley Solder Roundtable on November 6 at

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International Wafer-Level

Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation

Indium Corporation experts will share their knowledge and insights at two separate Electronic Industries Association of India (ELCINA) events at Productronica India from Sept. 26-28 in

Indium Corporation experts will share their industry knowledge and skill at SMTA International from Oct. 14-18 in Rosemont, Ill. The following technical papers from Indium Corporation

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will host a one-hour Thermal Live™ webinar at 10 a.m. EST on Oct. 23 regarding Innovation Metal Thermal

Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif. The following technical presentations from Indium Corporation