Comunicati stampa

Indium Corporation technology experts shared their technical expertise at SMTA International (SMTAI) October 16-17, 2012 in Lake Buena Vista, FL. All technical papers presented are available for

Indium Corporation's Product Support Specialist for PCB Assembly Materials, Brook Sandy-Smith will share her expertise at the SMTA Empire (New York) Expo and Technical Forum on November 8, 2012

Indium Corporation‘s Dr. Ning-Cheng Lee, vice president of technology, and Sehar Samiappan, area technical manager for North Malaysia, the Philippines, and Vietnam, will present at the 35th

Indium Corporation's Thin Film & Solar Products Director, Bill Jackson, will present at the Association of International Metallizers, Coaters and Laminators (AIMCAL) Web Coating and Handling

Indium Corporation technology experts shared their technical expertise at the International Microelectronics and Packaging Symposium 2012 (IMAPS) in San Diego, CA, held September 11 – 13,

Indium Corporation’s Eric Bastow, assistant technical manager, will present at the International Microelectronics and Packaging Society (IMAPS) Metro Chapter in Ronkonkoma, NY, on Wednesday,

Indium Corporation announces that Victoria (Vikki) Cruz-Griffith has joined the company as a Marcom Specialist. Vikki coordinates Indium Corporation’s global exhibition program to ensure

Indium Corporation announces that Jordan Ross has been promoted to senior product manager, Engineered Solders and Thermal Materials. Jordan leads business for Indium Corporation’s most diverse

Indium Corporation announces that Andy C. Mackie, PhD, MSc has been promoted to senior product manager, semiconductor and advanced assembly materials. Dr. Mackie leads the product development and

Indium Corporation gold-based solder alloys provide reliable joint strength and superior thermal conductivity, especially as compared to the standard SnPb or SAC solders. These alloys are well-suited

Indium Corporation will feature its enhanced copper-indium-gallium (CIG), copper-gallium (CuGa) rotary sputtering targets, and full family of PV Module Assembly Materials at the European Photovoltaic

Indium Corporation Senior Technical Support Engineer Mario Scalzo will share his expertise at IPC Midwest Conference and Exhibition on August 23,

Indium Corporation announces that Colleen Lamb has been named to the position of tactical buyer. Colleen is a focal point for day-to-day purchasing issues. Her responsibilities include coordinating

Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN

Agilent Technologies and Indium Corporation recently teamed together with UC Davis College of Engineering at the University of California to provide real world experiences for UC Davis students

Indium Corporation Research Metallurgist Weiping Liu was recognized for "Best Soldering Paper" at the 5th International Brazing and Soldering Conference (IBSC), hosted by ASM International

Indium Corporation announces Assistant Technical Manager Wisdom Qu, Assistant Technical Manager Eric Bastow, and Northeast Technical Support Engineer Amanda Hartnett as the company’s Silver

Indium Corporation will feature its enhanced copper-indium-gallium (CuInGa) and copper-gallium (CuGa) rotary sputtering targets at Intersolar North America, July 10-12, 2012 in San Francisco,

Indium Corporation announces that Tom Pearson has been named Sales Manager for the United States and Canada. In this new position, Tom manages the regional sales teams throughout the United States

Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, 2012, in San Francisco, California, USA. Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux

Indium Corporation's Heat-Spring® compressible soft metal thermal interface material is now being used in Green Revolution's CarnotJet™ liquid server cooling system. Green