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Indium Corporation announces that Colleen Lamb has been named to the position of tactical buyer. Colleen is a focal point for day-to-day purchasing issues. Her responsibilities include coordinating

Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN

Agilent Technologies and Indium Corporation recently teamed together with UC Davis College of Engineering at the University of California to provide real world experiences for UC Davis students

Indium Corporation Research Metallurgist Weiping Liu was recognized for "Best Soldering Paper" at the 5th International Brazing and Soldering Conference (IBSC), hosted by ASM International

Indium Corporation announces Assistant Technical Manager Wisdom Qu, Assistant Technical Manager Eric Bastow, and Northeast Technical Support Engineer Amanda Hartnett as the company’s Silver

Indium Corporation will feature its enhanced copper-indium-gallium (CuInGa) and copper-gallium (CuGa) rotary sputtering targets at Intersolar North America, July 10-12, 2012 in San Francisco,

Indium Corporation announces that Tom Pearson has been named Sales Manager for the United States and Canada. In this new position, Tom manages the regional sales teams throughout the United States

Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, 2012, in San Francisco, California, USA. Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux

Indium Corporation's Heat-Spring® compressible soft metal thermal interface material is now being used in Green Revolution's CarnotJet™ liquid server cooling system. Green

Indium Corporation announces that Robert Ploessl, PhD, has been named Product Manager for indium, gallium, germanium and tin compounds. In this new position,

Indium Corporation announces that Eugene Davies has been named applications engineer. He will be based at Indium Corporation’s Milton Keynes, UK, location. Eugene provides a wide range of

Indium Corporation has acquired a new manufacturing facility, located at 5836 Success Drive, Rome, NY, USA. The plant is currently being outfitted to expand production capacities of Indium

Indium Corporation announces that David Socha has been named Marketing and Technology Specialist. David analyzes and monitors adjacent markets for relevant technology developments. He also assesses

Indium Corporation experts will present their technical findings at the IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging May 22-23, in

Indium Corporation Northeast Technical Support Engineer Amanda Hartnett will present her technical findings at IMAPS NE 39th Symposium & Expo on May 8, 2012, in Boxborough,

Indium Corporation Director of Business Development and Printed Circuit Board Assembly products Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference,

Indium Corporation‘s Vice President of Technology Dr. Ning-Cheng Lee and Product Manager of PCB Assembly Materials Tim Jensen will present their technical findings at the SMTA South East Asia

Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen was recently recognized at IPC APEX Expo for his contributions to the electronics manufacturing industry and for contributing

Indium Corporation‘s Technical Manager for Europe, Karthik Vijay, will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.

Indium Corporation‘s Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6-8, 2012 in Scottsdale/Fountain Hills,

Indium Corporation‘s European Sales Manager for Metals, Compounds, and Solar Products Malcolm Harrower delivered a presentation to guests at Metal Bulletin’s Minor Metals Conference on