Comunicati stampa

Indium Corporation announces that Nicole Palma has been promoted to Senior Quality Engineer. Nicole’s new responsibilities include continued support for both internal and external customers;

Five of Indium Corporation’s technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010. Ning-Cheng Lee, Ph.D, Vice President of Technology Ronald C.

Indium Corporation announces that Jacques Matteau has joined the team as Global Sales Manager, NanoBond® and NanoFoil®. Jacques is based in San Carlos, California, USA. Jacques is

Indium Corporation announces that 20 of its employees from R&D, Technical Support and Applications Development received their certification in IPC-A-610D, Acceptability of Electronic Assemblies.

Indium Corporation announces the addition of Tan Hong Chai (Ben) as the Regional Sales Manager for East China. He is based in Suzhou,

Indium Corporation announces that Anthony Piccione, Quality Engineer, has earned his certification by the American Society for Quality (ASQ) as a Quality Engineer. A Certified Quality Engineer (CQE)

Indium Corporation announces that Penny Pitt has been hired as a Billing Coordinator. Penny is based at Indium’s global headquarters in Clinton, NY, USA. Penny is responsible for the daily

  Indium Corporation announces that Mike McNamara has been promoted to Corporate Quality Manager, George Kraeger has been named Corporate Analytical Laboratory Manager and Steve Foster has been

Indium Corporation announces that Jill Martin has been hired as an Account Specialist. Jill is based at Indium’s global headquarters in Clinton, NY, USA.   Jill is responsible for the

Indium Corporation’s Director of Metals & Chemicals, Claire Mikolajczak, is presenting at the Sustainability Summit 3-5 November in Milan, Italy. Claire’s presentation, Indium and

Indium Corporation’s Southeast Technical Support Engineer, Chris Nash, is presenting at the SMTA Space Coast Technical Conference on October 28, 2009, at the Gaylord Palms Hotel and Convention

Indium Corporation’s Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 27-30, 2009 in Santa Clara, CA. Dr.

Indium Corporation’s Technical Projects Manager, Mike Fenner, is presenting at the SMART Group’s 25th Anniversary Seminar on 22 October 2009 at the Oxfordshire Golf Club, Thame,

Five of Indium Corporation’s technology experts will be presenting their technical findings at SMTA International (SMTAI), October 4 – 8, 2009, at The Town and Country Resort and

Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of

Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules. Many

Indium Corporation announces the company’s Silver Quill Award winners for 2008. Best paper for 2008 goes to co-authors Chris Anglin and Ed Briggs, Technical Support Engineers; Tim Jensen,

Indium Corporation’s Dave Sbiroli, Applications Development Program Manager, was presented with the IPC Distinguished Committee Service Award at APEX 2009 in Las Vegas, Nevada. This award is

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized recently by two highly respected industry organizations as both a Distinguished Author and Distinguished

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, "Achieving High Reliability, Low Cost, Lead-Free SAC Solder Joints Via Mn or Ce Doping"

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5,