Communiqués de presse

Indium Corporation’s Technical Projects Manager, Mike Fenner, is presenting at the SMART Group’s 25th Anniversary Seminar on 22 October 2009 at the Oxfordshire Golf Club, Thame,

Five of Indium Corporation’s technology experts will be presenting their technical findings at SMTA International (SMTAI), October 4 – 8, 2009, at The Town and Country Resort and

Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of

Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules. Many

Indium Corporation announces the company’s Silver Quill Award winners for 2008. Best paper for 2008 goes to co-authors Chris Anglin and Ed Briggs, Technical Support Engineers; Tim Jensen,

Indium Corporation’s Dave Sbiroli, Applications Development Program Manager, was presented with the IPC Distinguished Committee Service Award at APEX 2009 in Las Vegas, Nevada. This award is

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized recently by two highly respected industry organizations as both a Distinguished Author and Distinguished

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, "Achieving High Reliability, Low Cost, Lead-Free SAC Solder Joints Via Mn or Ce Doping"

Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 – April 5,

Indium Corporation has appointed Yankee Tronics, Inc. as its newest sales representative in upstate New York. Yankee Tronics is responsible for selling all of Indium’s solder products including

Under the newly formed business of Foundation Technologies, Barry O’Brien remains the sole representative for Indium Corporation in Ohio. Based in Cleveland, Ohio, Foundation Technologies is

Indium Corporation’s Karthik Vijayamadhavan is scheduled to present at the chapter meeting for the San Diego Surface Mount Technology Association (SMTA) on March 11,

Indium Corporation announces that Paul Socha has been promoted to Manager of Applications Engineering. Paul is based at Indium’s global headquarters in Clinton, NY,

Indium Corporation’s Senior Technical Support Engineer Mario Scalzo and Technical Support Engineer Ed Briggs had their papers accepted for presentation at the IPC/JEDEC Conference,

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at

Indium Corporation has named DMP Products, LLC, as its newest sales channel partner. DMP Products focuses primarily on selling Indium Corporation’s PCB assembly products in Indiana and

Indium Corporation announces that Nicole Palma has completed the requirements for the American Society for Quality (ASQ) to be named as a Certified Quality

Indium Corporation announces the promotion of David Sbiroli to Manager of Technical Services for the Americas region. In his new role, Dave is responsible for the training and management of

Indium Corporation announced that William (Bill) Brunstedt has been appointed Associate Director of Sales and Marketing for the Asia Pacific region. Bill is responsible for integrating sales

Indium Corporation announced that Guido Lanoye has been promoted to Sales Manager for Indium Corporation in Europe. Guido is responsible for driving and managing Indium’s sales activities for

Indium Corporation was recognized with the Global Technology Award for its Indium5.1AT Pb-Free Solder Paste. Sponsored by Global SMT & Packaging magazine, the award acknowledges outstanding