CLINTON, N.Y., January 15, 2026 — Indium Corporation experts will deliver presentations on soldering processes and sinter material selection at NEPCON Japan 2026. The 40th-anniversary conference, held in Tokyo, Japan, from January 21-23, 2026, highlights R&D and manufacturing.
Assistant Product Manager for Engineered Solder Materials Sunny Neoh will present Materials Technology for Flux-Free Soldering on Thursday, January 22, from 2:00-2:30 p.m. JST. The presentation will examine best practices for flux-free soldering process development and how selecting the proper materials can improve efficiency through reduced labor and lower cycle times.
Dean Payne, Product Manager – Semiconductor, will present Next-Gen Copper Sinter Materials of Power Electronics on Thursday, January 22, from 3:00-3:30 p.m. JST. Pressure and pressureless sintering with silver is now mainstream in power electronics assembly. Payne’s presentation will explore the use of copper sinter paste for various applications, including die-attach and substrate-attach, and the different materials developed for these applications.
About the Presenters
Sunny Neoh is based at Indium Corporation’s Penang Tech Hub in Malaysia and is responsible for working closely with the operations and R&D teams to develop strategies for the company’s engineered solder materials. He has more than 20 years of engineering experience spanning both the SMT and semiconductor industries. He earned his bachelor’s degree in materials engineering from the Universiti Sains Malaysia and is certified as a Six Sigma Green Belt.
Dean Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials.
To discover additional exhibitors’ product and technology seminars occurring at NEPCON Japan, visit Exhibitors’ Product / Technology Seminar – New TechTrend.
To learn more about Indium Corporation’s innovative soldering solutions and sintering materials, visit their website.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
