CLINTON, N.Y., January 15, 2026 — Indium Corporation experts will deliver presentations on soldering processes and sinter material selection at NEPCON Japan 2026. The 40th-anniversary conference, held in Tokyo, Japan, from January 21-23, 2026, highlights R&D and manufacturing.
Assistant Product Manager for Engineered Solder Materials Sunny Neoh will present Materials Technology for Flux-Free Soldering on Thursday, January 22, from 2:00-2:30 p.m. JST. The presentation will examine best practices for flux-free soldering process development and how selecting the proper materials can improve efficiency through reduced labor and lower cycle times.
Dean Payne, Product Manager – Semiconductor, will present Next-Gen Copper Sinter Materials of Power Electronics on Thursday, January 22, from 3:00-3:30 p.m. JST. Pressure and pressureless sintering with silver is now mainstream in power electronics assembly. Payne’s presentation will explore the use of copper sinter paste for various applications, including die-attach and substrate-attach, and the different materials developed for these applications.
About the Presenters
Sunny Neoh is based at Indium Corporation’s Penang Tech Hub in Malaysia and is responsible for working closely with the operations and R&D teams to develop strategies for the company’s engineered solder materials. He has more than 20 years of engineering experience spanning both the SMT and semiconductor industries. He earned his bachelor’s degree in materials engineering from the Universiti Sains Malaysia and is certified as a Six Sigma Green Belt.
Dean Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials.
To discover additional exhibitors’ product and technology seminars occurring at NEPCON Japan, visit Exhibitors’ Product / Technology Seminar – New TechTrend.
To learn more about Indium Corporation’s innovative soldering solutions and sintering materials, visit their website.
À propos d'Indium Corporation
IndiumCorporation® est l'un des principaux raffineurs, fondeurs, fabricants et fournisseurs de matériaux destinés aux marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Sa gamme de produits comprend des soudures et des flux ; des alliages de brasage ; des matériaux d'interface thermique ; des cibles de pulvérisation ; de l'indium, du gallium, du germanium et de l'étain sous forme de métaux et de composés inorganiques ; ainsi quele NanoFoil®. Fondée en 1934, la société dispose d'un service d'assistance technique mondial et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
