Press Releases

Indium Corporation has welcomed two new technical support engineers to its global support team. Meagan Sloan and Miloš Lazi are responsible for providing expert technical assistance and

Indium Corporation, Utica’s Technology Company®, has named Brook Sandy-Smith, Technical Support Engineer for PCB Assembly, the winner of the 2017 Silver Quill Award. Indium

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared industry insights on indium supply and demand at the 11th World Indium and Germanium and Gallium

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at Advanced Driver Assistance Systems (ADAS), April

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will deliver a special statistics training at the SMTA Ohio Valley’s Chapter meeting on April 19 at Corporate

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her perspective on indium supply and demand at the Minor Metals Trade Association (MMTA)

Indium Corporation, Utica’s Technology Company®, has named Michael Schmitt as Production Supervisor. Based at Indium Corporation’s Rome facility, Schmitt is responsible for the

Two Indium Corporation experts will present at the Electronics in Harsh Environments Conference on April 24-26 in Amsterdam, Netherlands. Karthik Vijay, Technical Manager for

Indium Corporation’s Andy Seager has been named European Sales Manager. Based in Milton Keynes, United Kingdom, Seager is responsible for developing and implementing sales strategies

Indium Corporation’s Jonathan Minter, Research and Development Metallurgy Technician, will present at the TMS 2018 Annual Meeting & Exhibition on March 11-15 in Phoenix, Ariz. High-Pb

Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, was recognized with two Distinguished Committee Service Awards from IPC at the IPC APEX

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX Expo technical conference on February 27 in

Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Defense + Commercial Sensing Expo, April 15-19, in Orlando, Fla. Depending on the alloy, gold-based

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the InnovationsFORUM Germany on March 7 in Böblingen,

Indium Corporation will feature its low-voiding solder products Live@APEX in partnership with equipment suppliers throughout the IPC APEX Expo on February 27-March 1 in San Diego,

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March

Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16,

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the IPC APEX

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 in San Antonio, Texas. Dr.

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2018, March 4-8, in San Antonio, Texas. Indium Corporation is redefining solder with its

Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif. Vice President