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Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its Core 230-RC flux-cored wire at the IPC APEX Expo technical conference on February 27 in

Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Defense + Commercial Sensing Expo, April 15-19, in Orlando, Fla. Depending on the alloy, gold-based

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the InnovationsFORUM Germany on March 7 in Böblingen,

Indium Corporation will feature its low-voiding solder products Live@APEX in partnership with equipment suppliers throughout the IPC APEX Expo on February 27-March 1 in San Diego,

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March

Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16,

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the IPC APEX

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 in San Antonio, Texas. Dr.

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2018, March 4-8, in San Antonio, Texas. Indium Corporation is redefining solder with its

Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif. Vice President

Indium Corporation Technical Support Engineer Kim Flanagan shared her expertise at the SMTA Space Coast Expo & Tech Forum on January 18 in Melbourne, Fla. Flanagan’s

Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16,

Indium Corporation has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters. “SRI Quality System Registrar (SRI) is

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium 2018 (Pan

Indium Corporation, Utica’s Technology Company®, announces new additions and promotions within its Inside Sales Department. Lisa Clark has been named Inside Sales Assistant Manager.

Indium Corporation will feature Indium11.8HF-SPR Solder Paste a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of

Indium Corporation has named Anita Brown as Associate Director, Marketing Communications. Brown is responsible for managing the strategic planning initiatives for the Marcom

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in

Indium Corporation proudly announces that Rick Short, Corporate Associate Vice President and Senior Director of Marketing Communications, and Jim McCoy, Talent Acquisition Supervisor,

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan. Indium Corporation is redefining solder with