Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX®, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.
O Dr. Zhang é um metalúrgico de investigação do departamento de investigação e desenvolvimento da Indium Corporation. O seu foco é o desenvolvimento de materiais de solda sem chumbo para aplicações de alta temperatura e/ou alta resistência à fadiga, e a investigação de tecnologias associadas. Ele e o Dr. Ning-Cheng Lee inventaram a técnica de soldadura de pó misto, na qual são utilizados aditivos menores para melhorar a humidade e modificar a interface de ligação, aumentando assim a força de ligação. Com base nesta técnica, o sistema de soldadura BiAgX® foi inventado como uma alternativa à soldadura sem chumbo a alta temperatura.
Dr. HongWen Zhang has a bachelor’s degree in Metallurgical Physical Chemistry from Central South University of China, a master’s degree in Materials Science and Engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in Mechanical Engineering, and a PhD in Materials Science and Engineering from Michigan Technological University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
