Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX®, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.
O Dr. Zhang é um metalúrgico de investigação do departamento de investigação e desenvolvimento da Indium Corporation. O seu foco é o desenvolvimento de materiais de solda sem chumbo para aplicações de alta temperatura e/ou alta resistência à fadiga, e a investigação de tecnologias associadas. Ele e o Dr. Ning-Cheng Lee inventaram a técnica de soldadura de pó misto, na qual são utilizados aditivos menores para melhorar a humidade e modificar a interface de ligação, aumentando assim a força de ligação. Com base nesta técnica, o sistema de soldadura BiAgX® foi inventado como uma alternativa à soldadura sem chumbo a alta temperatura.
Dr. HongWen Zhang has a bachelor’s degree in Metallurgical Physical Chemistry from Central South University of China, a master’s degree in Materials Science and Engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in Mechanical Engineering, and a PhD in Materials Science and Engineering from Michigan Technological University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
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