Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX®, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.
Il Dr. Zhang è un ricercatore metallurgico del dipartimento di ricerca e sviluppo di Indium Corporation. La sua attività si concentra sullo sviluppo di materiali di saldatura senza piombo per applicazioni ad alta temperatura e/o ad alta resistenza alla fatica e sullo studio delle tecnologie associate. Insieme al Dr. Ning-Cheng Lee ha inventato la tecnica di saldatura a polvere mista, in cui vengono utilizzati additivi minori per migliorare la bagnatura e modificare l'interfaccia di legame, aumentando così la forza di legame. Sulla base di questa tecnica, è stato inventato il sistema di saldatura BiAgX® come saldatura alternativa senza piombo ad alta temperatura.
Dr. HongWen Zhang has a bachelor’s degree in Metallurgical Physical Chemistry from Central South University of China, a master’s degree in Materials Science and Engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in Mechanical Engineering, and a PhD in Materials Science and Engineering from Michigan Technological University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
