Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX®, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.
張博士是 Indium Corporation 研發部門的冶金研究員。他的工作重點是開發適用於高溫和/或高耐疲勞應用的無鉛焊接材料，以及相關技術的研究。他和Ning-Cheng Lee 博士發明了混合粉末焊料技術，在此技術中使用少量添加劑來改善濕潤性和修改接合界面，從而提高接合強度。在此技術的基礎上，發明了BiAgX®焊料系統，作為高溫無鉛焊料的替代品。
Dr. HongWen Zhang has a bachelor’s degree in Metallurgical Physical Chemistry from Central South University of China, a master’s degree in Materials Science and Engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in Mechanical Engineering, and a PhD in Materials Science and Engineering from Michigan Technological University.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
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