Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX®, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.
Dr. Zhang is a Research Metallurgist for Indium Corporation’s research and development department. His focus is on the development of lead-free solder materials for high temperature and/or high fatigue resistance applications, and the investigation of associated technologies. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique in which minor additives are used to improve the wetting and modify the bonding interface, thus increasing the bonding strength. On the basis of this technique, the BiAgX® solder system was invented as an alternative high-temperature lead-free solder.
Dr. HongWen Zhang has a bachelor’s degree in Metallurgical Physical Chemistry from Central South University of China, a master’s degree in Materials Science and Engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in Mechanical Engineering, and a PhD in Materials Science and Engineering from Michigan Technological University.
铟泰公司 是一家面向全球电子、半导体、太阳能、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料、焊片 以及助焊剂；硬钎焊 ；溅射靶材 ；铟、镓（Ga） 以及锗金属和无机化合物 ；以及NanoFoil®。Indium公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡 、韩国、英国和美国设有工厂。
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