Indium Corporation will feature its Indium8.9HF Solder Paste at the China High-End SMT Academic Conference, Oct. 23, Chengdu, China.
Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process.
Índio8.9HF:
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Resiste ao espalhamento prematuro do fluxo para evitar a oxidação das superfícies
- Funciona com ligas de Pb e sem Pb
For information on Indium8.9HF, visit Indium Corporation at the show, or indiumstg.wpenginepowered.com/avoidthevoid.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
