Indium Corporation will feature its Indium8.9HF Solder Paste at the China High-End SMT Academic Conference, Oct. 23, Chengdu, China.
Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process.
铟8.9HF：
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- 防止助焊剂过早扩散，防止表面氧化
- 适用于铅合金和无铅合金
For information on Indium8.9HF, visit Indium Corporation at the show, or www.indium.com/avoidthevoid.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
