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Indium Corporation to Feature Indium8.9HF Solder Paste at China High-End SMT Academic Conference

Indium Corporation will feature its Indium8.9HF Solder Paste at the China High-End SMT Academic Conference, Oct. 23, Chengdu, China.

Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process.

铟8.9HF:

  • Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • 防止助焊剂过早扩散,防止表面氧化
  • Performs with both Pb and Pb-free alloys

For information on Indium8.9HF, visit Indium Corporation at the show, or indiumstg.wpenginepowered.com/avoidthevoid.

铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂;硬钎焊;热界面材料;溅射靶材;铟、镓(Ga)、锗和锡的金属及化合物;以及NanoFoil®。公司成立于1934年,拥有全球技术支持网络,并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息,请访问indiumstg.wpenginepowered.com或发送电子邮件[email protected]。您还可以通过www.facebook.com/indium@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”(#FOETA)。