Indium Corporation will feature its Indium8.9HF Solder Paste at the China High-End SMT Academic Conference, Oct. 23, Chengdu, China.
Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process.
Indium8.9HF：
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- 在室溫下放置一個月後，仍可維持優異的印刷與回流焊效能
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- 防止助焊劑過早擴散，防止表面氧化
- 適用於含 Pb 和不含 Pb 的合金
For information on Indium8.9HF, visit Indium Corporation at the show, or indiumstg.wpenginepowered.com/avoidthevoid.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
