Experience Proven Excellence with Indium8.9HF Series

Recently, I've fielded several requests to clarify the distinction between "halide-free" and "halogen-free." Both terms apply to the composition of soldering fluxes in the

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

SIR testing—Surface and Insulation Resistance testing—has been around for a

Folks, Matching a reflow profile to a solder paste spec is a required skill foran SMT process engineer. In light of this, let’s do an example. Assume we want to start using Indium

In my last post, I talked about the advancements of medical technologies over the past century that have contributed to improving our quality of life, raising our life expectancy, and preventing

So I have run into a problem with the phrase "High-Reliability" recently. By that I mean there have beenseveral situations where I said "high-reliability,"someone else has too,

When I was first introduced to QFN voiding, it appeared to be a straightforward issue: outgassing from flux creates pockets of entrapped air causing reliability problems. But I’ve since come to