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SACm® Soldering Alloy

Home » Products » Solder Paste and Powders » SACm®

  • SACm® Soldering Alloy
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SACm® Soldering Alloy
Watch the SACm® Solder Paste Video

  • Easily substituted into existing Pb-free processes
  • Comparable reliability to SAC305 and SnPb eutectic
    • Superior drop shock resistance
    • Maintains thermal cycling reliability with Mn

Current Industry Dilemma:

Conventional SAC alloys exist with an inherent trade-off between thermal cycling reliability (TCR) and drop shock resistance (DSR). High Ag versions do not live up to the expectations of SnPb DSR, whereas low Ag versions offer improved DSR, but lose TCR.

The Solution:

With the addition of Mn, SACm®does not compromise on reliability. The combination of low Ag, for lower material costs and improved TCR over other low Ag alloys, integrates easily into existing Pb-free processes.

The Details:

SACm® is comprised of 97.5-98.5% Sn, 0.5-1.0% Ag, and 0.5-1.0% Cu, with dopant levels of Mn. This alloy is available in solder spheres as well as powder (T3, T4, and T4.5) and solder paste.

Drop Testing vs. Thermal Cycling                  Cost vs. Reliability

Drop Testing vs. Thermal Cycling Chart
(Click To Enlarge)
Cost vs. Reliability Chart
(Click To Enlarge)

SACm® Basic Material Properties

  SACm® SAC105 SAC305
Melting Point
  Solidus °C
  Liquidus °C
 
217
226
 
217
225
 
217
220
Tensile Strength
(PSI)
5625 5640 7200
Yield Strength
(PSI)
3590 3359 5289
Young's Modulus
(KSI)
2110 2150 2410
Elongation
(%)
15.7 13.4 19.3

JEDEC Drop Test Performance

Typically, improved drop shock resistance is achieved with low Ag content SAC solder alloys. However, SAC105 (or even SAC0307) still does not equal the DSR of SnPb eutectic alloys. SACm® delivers significantly improved DSR, rivaling SnPb drop shock performance.

Testing Conditions:

  • Components – 0.5mm pitch BGA
  • PCB – 8 layer FR4 with OSP finish
  • Test Conditions – JESD22-B111
  • Preconditioning – 250 cycles of thermal cycling
JEDEC Drop Test: Characteristic Life (TFBGA)
(Click To Enlarge)
Weibull Plot for Drop Test of SnPb, SAC105, SAC305, SACm®
(Click To Enlarge)

Thermal Cycling

Low Ag content will also have the trade-off of compromised thermal cycling reliability. SACm® boosts TCR, greatly outperforming SAC105, and is comparable to SAC305.

Testing Conditions:

  • Components – 0.5mm pitch BGA
  • PCB – 8 layer FR4 with OSP finish
  • -40oC to +125oC; 42 min/cycle; 10 minute dwells

Preconditioning:

  • Bake at 150°C for 250 hours
Thermal Cycling: Characteristic Life (TFBGA)
(Click To Enlarge)
Weibull sPlot for Thermal Cycling of SnPb, SAC105, SAC305, SACm
(Click To Enlarge)

How SACm® Works

Aging Condition: 3 Weeks @ 125°C
(Click To Enlarge)

The addition of Mn helps improve reliability in two ways: it refines and limits the IMC formed, and, over time, impedes intermetallics growth and grain coarsening. A thin IMC layer shows improved DSR and TCR, whereas Mn further improves TCR by minimizing IMC layer growth.

SACm® shows an insignificant decline in shear testing after aging due to Mn maintaining the IMC layer thickness (see graph on right).

Cross sections (below), show the IMC layer before and after 1000 hours of aging. It is evident that the amount of intermetallic growth is drastically reduced, mirroring the improved reliability results.

Cross sections of before and after aging

SACm® Solder Paste

SACm® solder powder is available in IPC standard T3, T4, and Indium’s T4.5 for optimal miniaturized printing applications. Indium Corporation provides top quality solder pastes for PCB assembly. To meet individual assembly needs, several fluxes from the Pb-free series of fluxes are offered with SACm®.

Shared features:

  • First-class printing performance
    • Consistent print transfer through apertures with area ratios ≤0.66
    • Long stencil life and forgiving response-to-pause
    • High component retention tack prevents components from shifting
  • Robust reflow performance
    • Unique oxidation barrier technology to eliminate defects during reflow
    • Wide process window for flexible reflow profiling
    • Good wetting performance on various surface finishes
Paste Name (Flux) Halogen-Free? Powder Size Stencil Printing
Metal Load
Features
Indium8.9 No T3
T4
88.50%
88.25%
Eliminates HIP
Indium10.1 No T3
T4
88.75%
88.50%
Lowest Voiding
Indium8.9HF Yes T3
T4
89%
88.50%
HF versatile performance
RMA-155 Yes T3
T4
89%
88.50%
RMA for modern challenges

Typical SACm® Reflow Profile

Pb-Free Reflow Profile Chart
(Click To Enlarge)

Related Markets and Applications

  • Surface Mount

Top SACm® Technical Documents

  • Indium8.9 Pb-Free Solder Paste (US Letter)

    Product Data Sheet

  • Indium8.9 Pb-Free Solder Paste (A4)

    Product Data Sheet

  • Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping (Paper)

    Technical Paper

  • The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn (Paper)

    Technical Paper

SACm® Technical Documents

Whitepapers

Request This Document

Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping

Authors: Dr. Ning-Cheng Lee, Dr. Ronald C. Lasky, Timothy Jensen

Request This Document

The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn

Authors: Dr. Ning-Cheng Lee

Request This Document

The Proliferation of Lead-Free Alloys

Authors: Eric Bastow, Timothy Jensen

Presentations

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Application Notes

No application notes to display

Product Data Sheets

Indium8.9 Pb-Free Solder Paste (A4)
Indium8.9 Pb-Free Solder Paste (US Letter)

Safety Data Sheets

No safety data sheets to display

SACm® Blog Posts

Tech Seconds: What is a Shoulder Reflow Profile?

04 Sep 2018 by Phil Zarrow [view bio]

In this installment of Tech Seconds, Phil describes when to use a shoulder profile.

Read More

The Right Solder Alloy for the Right Application

04 Dec 2017 by Carol Gowans [view bio]

Indium Corporation is the leading expert in solder alloy selection...the right alloy for the right application.

Read More

Fluxless Soldering of 80Au/20Sn with Forming Gas/Inert Atmosphere

03 Aug 2017 by Karthik Vijay [view bio]

Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms - I'll tell you how.

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Christopher Nash
Product Manager PCB Assembly Materials
cnash@indium.com

From One Engineer to Another®

All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.

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