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Optimizing the Epoxy Flux Dipping Process
Applying Epoxy flux using a dipping process is similar to the dipping process with conventional PoP flux, with the exception of the flux coverage of the component bump.With conventional PoP flux or
Quy tắc 3/N để ước tính tỷ lệ hỏng hóc tại hiện trường
Mọi người ơi, có vẻ như Patty hơi có vấn đề……. Khi còn nhỏ, Patty luôn khó chịu với những người già cáu kỉnh, và bây giờ cô ấy lo lắng rằng mình có thể trở thành một người như vậy. Nguyên nhân là
Why Epoxy Flux
Due to the recent increase in interest regarding Epoxy Flux, there are a number of general questions that many people have had about the this unique enabling technology.I decided to sit down with the
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Optimizing the PoP Flux Dipping Process
Often times, people assume that the dipping process is easy. It is…once you have taken the time up-front to optimize the process.This optimization can take a bit of time and trial and error.
Gali: Được phát hiện quá muộn để có trong Bảng tuần hoàn đầu tiên của Mendeleev
Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can
Graphene: Một ứng cử viên không thể thay thế ITO trong màn hình phẳng
Mọi người ơi, chúng ta hãy đến thăm Rob, trong khi Patty đi vắng…… Rob vẫy tay chào tạm biệt Patty khi cô ấy lái xe đến sân bay để tham dự một hội nghị kéo dài một tuần. Bây giờ cô ấy là giáo sư và anh ấy là sinh viên sau đại học
Thay đổi thành phần của nồi hàn thiếc-chì của bạn
Trong ngành sản xuất điện tử ngày nay, nhiều công ty đang sử dụng hợp kim hàn không chì. Tuy nhiên, có một số ngành trong ngành thích độ tin cậy và hiệu suất của
Making Solder Preforms – Cutting
There are many more ways to cut a solder preform than most customers realize. We use each of these methods depending on the volume, precision, or complexity of the solder preform. Whichever method we
Nhảy vào Phân tích JMP- ANOVA
My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests
Biểu đồ Pareto Dữ liệu của bạn để giúp cải tiến liên tục
After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjoying the academic environment and this weekly lunch was
Họ hợp kim hàn
Have you ever had to choose something (a new computer, kitchen cabinets, eyeglasses) and had so many choices that you became overwhelmed and got analysis paralysis? You might feel that way when
Preheating Series
An Introduction Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This series will be similar, except preheaters will be
Alloy Melting
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin
Wave Soldering is Here to Stay
Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It
Growing Interest in Bi-Containing Solder Alloys: Bismuth Rocks!
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due
Specifying Solder Preforms – Engineering Drawing/Specification
Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You
Specifying Solder Preforms – Packaging
Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your
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