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Optimizing the Epoxy Flux Dipping Process
Applying Epoxy flux using a dipping process is similar to the dipping process with conventional PoP flux, with the exception of the flux coverage of the component bump.With conventional PoP flux or
Why Epoxy Flux
Due to the recent increase in interest regarding Epoxy Flux, there are a number of general questions that many people have had about the this unique enabling technology.I decided to sit down with the
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
镓(Ga):发现得太晚,未能列入门捷列夫的第一张元素周期表
大家好,好久不见。让我们来看看帕蒂的情况……帕蒂盯着她的新款Apple® Watch,心里很满意。最让她高兴的是,她原本根本没料到自己会这么满意。她听过很多……
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can
石墨烯:取代平板显示器中 ITO 的不二之选
伙计们,让我们来看看罗布的情况,帕蒂正在离开......,当帕蒂开车去机场参加为期一周的会议时,罗布向她挥手告别。现在,她是一名教授,而他是一名研究生
Making Solder Preforms – Cutting
There are many more ways to cut a solder preform than most customers realize. We use each of these methods depending on the volume, precision, or complexity of the solder preform. Whichever method we
跳转到 JMP- 方差分析
My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests
帕累托数据图表有助于持续改进
After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjoying the academic environment and this weekly lunch was
Solder Alloy Families
Have you ever had to choose something (a new computer, kitchen cabinets, eyeglasses) and had so many choices that you became overwhelmed and got analysis paralysis? You might feel that way when
Preheating Series
An Introduction Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This series will be similar, except preheaters will be
Alloy Melting
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin
Wave Soldering is Here to Stay
Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It
对含铋焊料合金的兴趣与日俱增:铋岩
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due
Specifying Solder Preforms – Engineering Drawing/Specification
Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You
Specifying Solder Preforms – Packaging
Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your
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