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Specifying Solder Preforms – Engineering Drawing/Specification

Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You

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Fluxers Part I – Foam: Wave Soldering (A Segmented Synopsis) Post #3

A wave solder machine’s foam fluxer is a device in which compressed air is fed through a porous tube (commonly referred to as a “stone” because this part used to be made out of

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Specifying Solder Preforms – Packaging

Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your

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Fluxers – An Introduction: Wave Soldering (A Segmented Synopsis) Post #2

Flux is an essential component in the creation of a solder joint. For the sake of this post, I will be referencing flux as it is used in wave soldering machines. But, if you want to know of other

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Wave Soldering (A Segmented Synopsis): Post #1

There are many types of wave solder machines, each with their own quirks, characteristics, and personalities. The good news is, each has the same core process elements, making it easier (maybe not

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Electronics Assembly Process Optimization Using AuditCoach™

Let's check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar EMS company, he was used to doing the intimidating. However, he

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Specifying Solder Preforms – Flux

Flux… It would be great to live in a world where we didn’t need it. Unfortunately, that same oxygen that keeps us alive slowly erodes the solderability of surface finishes on most

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Fluxless Soldering

When I was learning about solder, I was very surprised when I received a call inquiring about fluxless soldering. Trulyproviding a goodsolder jointwithout using flux; pretty selfexplanatory. Ever

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Die-Attach Soldering Using Indium Alloys

There are at least three significant reasons to use indium solder alloys in your die-attach operation: Physical performance, Supplier reliability, Material dependability: Physical: Indium-containing

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Specifying Solder Preforms – Dimensions

Have you ever ordered something in the wrong size? It’s frustrating. Whether it’s a jacket that’s too tight or a refrigerator that is too big, the worst time to learn about the

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什么是 Cicret 及其重要性?

朋友们,让我们来看看帕蒂......,帕蒂不得不承认她越来越烦了。两个工程系的女学生总是去她丈夫罗布的办公室找她。

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The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below

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Outsourcing Manufacturing is not Part of DFM

Folks, Looks like Patty has been busy….. Patty couldn’t remember having a busier week. She just got back on Friday from serving on a review board for statistics projects that West Point

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10 西格玛焊膏印刷工艺?

SigFolks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s smallest electronics components, known as

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SMT Optimization For Success – Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT

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使用 StencilCoach 对焊料预型件进行针插孔径计算

朋友们,正如上一篇文章中提到的,PIP(焊针粘贴)工艺的一个常见问题是难以获得足够的焊料。

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Optimization for Success: Solder Mask Defined vs. Copper Defined Non-Solder Mask Defined) Pads

Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure

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How to Evaluate a Wave Solder Flux

The title of this blog is a little misleading because it is actually going to focus on aninappropriatemethod that is sometimes used in wave solder flux evaluations. It is always desirable to identify

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使用StencilCoach(TM)计算针插孔径焊锡量

Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of through-hole components. However, assuring that the correct

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带半径角的方形与圆形孔径:成功的 SMT 优化第 4 部分:

在不断研究和寻求改进锡膏印刷以实现精细锡膏沉积的过程中,我们还发现一致性(低标准偏差)更有利于方形孔径,当

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Properties and Applications of Low Temperature Solders – don’t miss this presentation!

If you are attending SMTAI this year, you should not miss Dr. Ning-Cheng Lee’s professional development course on Properties and Applications of Low Temperature Solders. The course discusses

在 Indium,我们研究、开发和制造先进的电子组装材料解决方案,以应对当今、未来和未来的挑战。