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Optimizing the Epoxy Flux Dipping Process

Applying Epoxy flux using a dipping process is similar to the dipping process with conventional PoP flux, with the exception of the flux coverage of the component bump.With conventional PoP flux or

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估算现场故障率的 3/N 规则

朋友们,看来帕蒂有点烦恼.......。帕蒂年轻时总是被脾气暴躁的老人惹恼,现在她担心自己也会变成这样的老人。触发

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Why Epoxy Flux

Due to the recent increase in interest regarding Epoxy Flux, there are a number of general questions that many people have had about the this unique enabling technology.I decided to sit down with the

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Voiding in the Thermal Ground Pad of BTC Components

Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:

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Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

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Optimizing the PoP Flux Dipping Process

很多时候,人们认为浸渍过程很简单。其实不然......只要您事先花点时间优化流程。

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镓(Ga):发现得太晚,未能列入门捷列夫的第一张元素周期表

大家好,好久不见。让我们来看看帕蒂的情况……帕蒂盯着她的新款Apple® Watch,心里很满意。最让她高兴的是,她原本根本没料到自己会这么满意。她听过很多……

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Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

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Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is

Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can

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石墨烯:取代平板显示器中 ITO 的不二之选

伙计们,让我们来看看罗布的情况,帕蒂正在离开......,当帕蒂开车去机场参加为期一周的会议时,罗布向她挥手告别。现在,她是一名教授,而他是一名研究生

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改变锡铅焊锅的成分

In today's electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industry that prefer the reliability and performance of

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Making Solder Preforms – Cutting

There are many more ways to cut a solder preform than most customers realize. We use each of these methods depending on the volume, precision, or complexity of the solder preform. Whichever method we

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跳转到 JMP- 方差分析

My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests

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帕累托数据图表有助于持续改进

After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjoying the academic environment and this weekly lunch was

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Solder Alloy Families

Have you ever had to choose something (a new computer, kitchen cabinets, eyeglasses) and had so many choices that you became overwhelmed and got analysis paralysis? You might feel that way when

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Preheating Series

An Introduction Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This series will be similar, except preheaters will be

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Alloy Melting

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin

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Wave Soldering is Here to Stay

Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It

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对含铋焊料合金的兴趣与日俱增:铋岩

If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due

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Specifying Solder Preforms – Engineering Drawing/Specification

Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You

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Specifying Solder Preforms – Packaging

Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your

在Indium,我们致力于研究、开发和制造先进的电子组装材料 以应对当今、未来以及更长远的挑战。